Liquid Crystal Panel Cutting Step Structure
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Solution Overview
Problem
The existing methods for cutting liquid crystal display panels to desired sizes often damage signal lines or thin film transistors on the lower panel due to contact with the dispenser or pressure of the sealant during the sealant formation process.
Innovation Solution
The upper panel is cut with its edge protruding outward from the lower panel by 0.2 to 0.5 mm, creating a step at the cut surface, allowing the sealant to be applied without direct contact with the lower panel's components, thereby preventing damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the sealant is applied by moving a dispenser along the cut portion, then the sealant layer is formed to seal the liquid crystal layer, but the display signal lines or thin film transistors on the lower display panel are damaged by contact with the dispenser or pressure of the sprayed sealant
Solution Approach 1:
The patent introduces a height difference (step) between the first and second substrates at the cut portion, creating a vertical dimension barrier. The first substrate is positioned higher than the second substrate, forming a stepped structure that prevents the dispenser from contacting the lower substrate's sensitive components while still allowing sealant application along the cut edge.
Solution Approach 2:
The stepped structure acts as an intermediary barrier between the dispenser and the sensitive components on the lower substrate. The height difference creates a physical buffer zone that allows the sealant application process to occur without direct contact between the dispenser and the thin film transistors or signal lines.
2Manufacturing precision
If the dispenser contacts the lower display panel to apply sealant, then precise sealant placement is achieved, but the thin film transistors and signal lines are damaged
Solution Approach 1:
By creating a vertical height difference between substrates, the patent enables precise horizontal sealant placement along the cut portion while maintaining component integrity through the vertical buffer. The dispenser can accurately follow the cut edge at the higher substrate level without risking contact with components on the lower substrate.
3Productivity
If pressure is applied to spray sealant along the cut portion, then the sealant is deposited effectively, but the thin film transistors and signal lines on the lower panel are damaged
Solution Approach 1:
The stepped structure with height difference provides a spatial buffer that allows high-pressure sealant spraying to occur at the higher substrate level without the pressure affecting components on the lower substrate. The vertical separation protects sensitive components from both direct contact and pressure-induced damage during rapid sealant deposition.
Data Source
AI summary
The present invention relates to a method for cutting a liquid crystal display panel and a method for manufacturing a liquid crystal display panel having a desired size using the same. In a method for cutting a liquid crystal display panel which includes an upper panel to which a color filter is formed and a lower filter on which a thin film transistor is formed, the upper panel and the lower panel are respectively cut in such a way that a cut edge of the upper panel is outwardly protruded from a cut edge of the lower panel so that a step is formed at a cut surface between the upper panel and the lower panel. Since the cut edge of the upper panel is upwardly protruded from the cut edge of the lower panel, electrodes, signal lines, thin film transistors of the lower panel can be prevented from being damaged by the contact with the dispenser or by the pressure of the sprayed sealant while the sealant is formed after the cutting.