LCD Sealant Adhesion via Semiconductor Connection Layer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In LCD manufacturing, the adhesive force between the organic interlayer insulating film and the sealant is weaker than between the inorganic protective insulating film and the sealant, requiring additional processes to improve adhesiveness, which increases complexity and cost.
Innovation Solution
Forming a semiconductor connection layer made of the same material as the semiconductor layer in the seal portion, which is in contact with the sealant, to enhance the adhesive strength between the TFT substrate and the sealant without additional processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If an organic interlayer insulating film is formed on an inorganic protective insulating film to improve aperture ratio, then the aperture ratio is improved, but the adhesive force between the sealant and the substrate decreases
Solution Approach 1:
The patent applies preliminary action by forming a semiconductor connection layer in the seal portion before the sealant is applied. This layer is prepared in advance during the same step as the semiconductor layer formation, ensuring that when the sealant is later applied, it has a proper adhesive surface already in place, thus maintaining both high aperture ratio and strong adhesion.
Solution Approach 2:
The patent applies local quality by forming the semiconductor connection layer specifically in the seal portion where adhesion is needed, while maintaining the organic interlayer insulating film in the pixel portion to achieve high aperture ratio. This localized differentiation allows each region to have the properties it needs: insulation and adhesion.
2Strength
If the organic interlayer insulating film is removed in the seal portion to improve adhesion, then adhesive force is improved, but the manufacturing process complexity increases
Solution Approach 1:
The patent merges the formation of the semiconductor connection layer with the existing semiconductor layer formation step. By combining these two operations into a single manufacturing step, the patent achieves the desired adhesion improvement without adding process complexity, as the semiconductor connection layer is formed simultaneously with the semiconductor layer using the same deposition process.
Data Source
AI summary
A manufacturing process of an LCD device of the invention includes forming a first substrate provided with a pixel part with thin film transistors and a seal portion arranged around the pixel part, forming a second substrate opposed to the first substrate, filling a liquid crystal layer between the first substrate and the second substrate, and adhering the first substrate to the second substrate with a sealant provided for the seal portion, wherein the forming the first substrate includes forming a semiconductor layer composing the thin film transistor, forming in the seal portion a semiconductor connection layer made of a same material as the semiconductor layer, and forming an organic interlayer insulating film, wherein the forming the semiconductor layer and the forming the semiconductor connection layer are performed in the same step.