Liquid Crystal Display Wire Etching for Taper Angle Control

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Solution Overview

Problem

Existing liquid crystal display devices face complexity and cost issues due to the use of different materials for gate and source/drain wires, leading to varying electrical resistances and difficulties in adjusting wire thickness and taper angles, which complicates manufacturing and increases costs.

Innovation Solution

A manufacturing method using a wet etching process with etchants containing hydrofluoric acid and an oxidant, where the concentration of hydrofluoric acid differs for gate and source/drain wires, allowing for a multilayer structure of the same material with adjustable taper angles, reducing manufacturing complexity and cost.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If different materials are used for gate wires and source/drain wires, then electrical resistance can be optimized for each wire type, but manufacturing complexity increases and wire thickness adjustment becomes extremely complex

Engineering Contradiction:
Improveelectrical resistanceVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies homogeneity by using the same material (aluminum alloy) for both gate wires and source/drain wires, eliminating the need for separate material optimization and simplifying manufacturing processes. This resolves the contradiction by maintaining acceptable electrical resistance performance while dramatically reducing manufacturing complexity.

Inventive Principle:
Principle #33Homogeneity

Solution Approach 2:

The patent uses parameter changes by adjusting the thickness of the aluminum alloy wire through controlled etching processes to achieve the desired electrical resistance characteristics. Instead of using different materials, the invention optimizes resistance by varying physical parameters (thickness, width) of the same material, thereby simplifying manufacturing.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If wire thickness is adjusted to compensate for material differences, then electrical resistance can be equalized, but manufacturing steps become extremely complex

Engineering Contradiction:
Improveelectrical resistance equalityVSAvoidmanufacturing steps complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

By using the same aluminum alloy material for both wire types, the patent eliminates the need for complex thickness adjustment procedures to compensate for material differences. The homogeneous material approach allows for simpler, more standardized manufacturing processes while maintaining equal electrical resistance characteristics.

Inventive Principle:
Principle #33Homogeneity

3Manufacturing precision

If mask resolution limits wire width adjustment, then manufacturing precision is constrained, but alternative adjustment methods become even more complex

Engineering Contradiction:
Improvewire width adjustmentVSAvoidadjustment process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent addresses mask resolution limitations by using parameter changes in the etching process (etchant concentration, exposure time) to achieve precise wire width adjustments. This allows for fine-tuning of wire dimensions without requiring proportionally finer mask resolution, thereby maintaining manufacturing precision while avoiding increased process complexity.

Inventive Principle:
Principle #35Parameter changes

4Manufacturing precision

If plasma etching is used to adjust wire taper angle, then taper angle can be controlled, but manufacturing cost increases and throughput decreases

Engineering Contradiction:
Improvetaper angle controlVSAvoidmanufacturing throughput
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent replaces the plasma etching process (a complex, expensive, low-throughput process) with a simpler wet etching process using chemical solutions. This substitution maintains the ability to control wire taper angles with appropriate precision while dramatically improving manufacturing throughput and reducing costs, as wet etching can be performed more efficiently at scale.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

5Reliability

If gate insulating film has high withstanding voltage, then voltage protection is improved, but coverage requirement becomes more stringent

Engineering Contradiction:
Improvewithstanding voltageVSAvoidcoverage precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent addresses the coverage requirement by using parameter changes in the wire formation process (etching conditions, wire geometry) to ensure proper coverage of the gate insulating film. By optimizing these parameters, the invention achieves both high withstanding voltage capability and adequate film coverage without requiring proportionally higher precision in all manufacturing steps.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method enables easy adjustment of taper angles, ensures sufficient withstanding voltage for gate insulating films, increases wire density, and simplifies patterning, resulting in a cost-effective and efficient production of liquid crystal display devices with narrower frames.

Implementation Method 1

a wet etching process is carried out on the gate wires and the source/drain wires using an etchant including hydrofluoric acid and an oxidant

Methodology Applied
Scientific EffectWet etching:

Implementation Method 2

using an etchant including hydrofluoric acid and an oxidant where the concentration of hydrofluoric acid in the etchant is different for the etchant for the gate wires and the etchant for the source/drain wires

Methodology Applied
Scientific EffectChemical etching:

Data Source

PatentUS8743333B2Liquid crystal display device and manufacturing method for same
Publication Date: 2014.06.03 PANASONIC INTELLECTUAL PROPERTY CORP OF AMERICA
  • US8743333B2 patent drawing
  • US8743333B2 patent drawing
  • US8743333B2 patent drawing

AI summary

The present invention provides a liquid crystal display device having gate wires and source/drain wires with a multilayer structure made of the same material which can be manufactured at low cost, as well as a manufacturing method for the same. In accordance with the manufacturing method, a wet etching process is carried out on the gate wires and the source/drain wires using an etchant including hydrofluoric acid and an oxidant, and the concentration of hydrofluoric acid in the etchant is different between the etchant for the gate wires and that for the source/drain wires.