Thermoforming LCP Multilayer Circuit Boards
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Solution Overview
Problem
The existing methods for manufacturing three-dimensional multilayer circuit boards are inefficient due to a two-step heating and cooling process, which increases manufacturing time and limits productivity.
Innovation Solution
A method involving the use of liquid crystal polymer (LCP) layers with a bonding layer in between, where the stacked arrangement is heated and subjected to pressure to shape into a non-planar 3D form, concurrently bonding the layers, thereby thermoforming and laminating in a single step.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a two-step heating and cooling process is used to thermoform core layers individually and then laminate them, then the circuit board can achieve a non-planar 3D shape with bonded layers, but the manufacturing time increases and productivity is limited
Solution Approach 1:
The patent combines the thermoforming and lamination operations into a single simultaneous heating step. The stacked arrangement of LCP layers with bonding layers is heated to a temperature that allows both the LCP to soften for shaping and the bonding layer to activate for bonding, eliminating the need for separate heating and cooling cycles required in traditional two-step processes.
Solution Approach 2:
The patent utilizes the specific thermal properties of LCP materials by heating to a controlled temperature range that triggers both the softening of the LCP core layers for thermoforming and the bonding activation of the bonding layers. This parameter-based approach allows one heating step to achieve two distinct functional outcomes.
2Adaptability or versatility
If traditional polyimide material is used for multilayer thin film flexible circuit boards with integrated components, then the circuit board can support complex circuitry, but the material has undesirable characteristics
Solution Approach 1:
The patent employs LCP (liquid crystal polymer) as an alternative material system to traditional polyimide. LCP offers improved material characteristics including better thermal stability, lower dielectric loss, and enhanced mechanical properties while maintaining the ability to support complex multilayer circuitry and integrated components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing time by integrating thermoforming and lamination into a single step, enhancing productivity and allowing for the creation of complex, compact circuit board designs with improved mechanical and electrical properties.
Implementation Method 1
heating and applying pressure to the stacked arrangement to shape the stacked arrangement into a non-planar 3D shape
Implementation Method 2
concurrently causing the bonding layer to bond together the adjacent LCP layers of the stacked arrangement
Implementation Method 3
applying pressure to the stacked arrangement to shape the stacked arrangement
Data Source
AI summary
A method is for making a non-planar three-dimensional (3D) multilayered circuit board. The method may include forming a stacked arrangement including at least one pair of liquid crystal polymer (LCP) layers with a bonding layer therebetween. The stacked arrangement may further include at least one electrically conductive pattern layer on at least one of the LCP layers. The method may further include heating and applying pressure to the stacked arrangement to shape the stacked arrangement into a non-planar 3D shape and concurrently causing the bonding layer to bond together the adjacent LCP layers of the stacked arrangement to thereby form the non-planar 3D multi-layered circuit board.