LCP Circuit Board Reduces RC Delay
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Solution Overview
Problem
Conventional mobile device circuit boards face challenges in reducing Resistor-Capacitor (RC) delay due to high-frequency requirements, necessitating the development of advanced materials and structures to support gigahertz clock rates effectively.
Innovation Solution
The circuit board design incorporates multiple liquid crystal polymer (LCP) layers and adhesive layers, along with conductive vias, to create a structured configuration that enhances binding forces and reduces dielectric constant, facilitating high-frequency performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If conventional mobile device circuit boards are used, then the device can operate at high clock rates, but the Resistor-Capacitor delay increases due to high-frequency requirements
Solution Approach 1:
The patent changes the material parameter of the insulating structure from conventional materials to liquid crystal polymer (LCP) material, which has inherently lower dielectric constant and loss tangent values. This material parameter change directly reduces the RC delay while maintaining compatibility with high-frequency clock rates, resolving the contradiction between operating speed and signal delay
Solution Approach 2:
The patent employs composite material construction by combining LCP material with copper redistribution layers and adhesive layers in a multi-layer configuration. This composite structure optimizes the balance between electrical performance (low RC delay), mechanical integrity (adhesive bonding), and thermal management, enabling high-frequency operation with minimized signal loss
2Reliability
If LCP layers and adhesive layers are used in a structured configuration, then RC delay is reduced and thermal stability is improved, but the device complexity increases
Solution Approach 1:
The patent segments the insulating structure into multiple discrete LCP layers (first LCP layer, second LCP layer) separated by adhesive layers, with each layer serving specific functional purposes. This segmentation allows independent optimization of each layer's properties and facilitates modular manufacturing, reducing the practical complexity despite the multi-layer configuration
Solution Approach 2:
The LCP material serves multiple functions simultaneously: it provides electrical insulation with low dielectric properties, offers thermal stability for high-frequency operation, and enables precise patterning of redistribution layers. This multi-functionality reduces the need for additional specialized components, offsetting the complexity of the structured configuration
Data Source
AI summary
A circuit board includes a first insulating structure, a first redistribution layer, a second insulating structure, and a second redistribution layer. The first insulating structure has an upper surface and includes a first liquid crystal polymer layer. The first redistribution layer is disposed on the upper surface of the first insulating structure. The second insulating structure is disposed on the upper surface of the first insulating structure and covers the first redistribution layer. The second insulating structure has a top surface opposite to the upper surface and includes a second liquid crystal polymer layer. The second redistribution layer is disposed on the top surface of the second insulating structure.