LCP Lid and Lens Assembly for Compact Semiconductor Packaging

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional semiconductor packages face issues of excess cost, decreased reliability, and large package sizes, leading to inadequate performance.

Innovation Solution

The use of a liquid-crystal-polymer (LCP) lid with a pedestal and channel structure to precisely position a lens over an application-specific integrated circuit (ASIC), enhancing manufacturing precision and reducing damage by maintaining a controlled gap between components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional semiconductor packages are used, then manufacturing cost is reduced, but manufacturing precision and reliability decrease

Engineering Contradiction:

Improvemanufacturing precisionVSAvoidmanufacturing cost

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The lid is divided into multiple functional segments: a body portion, a pedestal structure, and a channel structure. This segmentation allows each component to perform its specific function independently, enabling precise lens positioning while maintaining manufacturing efficiency through modular assembly.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The pedestal acts as an intermediary structure between the lid body and the lens, providing precise positioning and support. The channel structure serves as another intermediary element that guides and constrains the lens position, ensuring manufacturing precision without requiring complex direct mounting processes.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Volume of moving object

If component gap is reduced to improve integration, then device size decreases, but component damage risk increases

Engineering Contradiction:

Improvepackage sizeVSAvoidcomponent damage risk

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The channel structure is designed with sufficient width to maintain an appropriate gap between the lens and surrounding components. This pre-established spatial buffer protects the lens from mechanical damage during assembly and operation, while still achieving compact overall package dimensions through optimized channel geometry.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Ease of manufacture

If lens positioning is loosened to ease assembly, then manufacturing complexity decreases, but manufacturing precision deteriorates

Engineering Contradiction:

Improveassembly easeVSAvoidlens positioning precision

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The channel structure is designed to automatically guide and position the lens during assembly through its geometric constraints. The channel's dimensions and shape provide self-aligning features that ensure precise lens positioning without requiring complex external positioning mechanisms or skilled manual assembly operations.

Inventive Principle:

Principle #25Self-service

4Reliability

If light isolation is enhanced to improve performance, then device performance increases, but device complexity increases

Engineering Contradiction:

Improvelight isolationVSAvoiddevice complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The channel structure serves multiple functions simultaneously: it provides mechanical support for the lens, defines the lens position, and creates light isolation barriers. By integrating these functions into a single structural element rather than adding separate components, the patent achieves enhanced light isolation without proportionally increasing device complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS20250351598A1Semiconductor devices and methods of manufacturing semiconductor devices

Publication Date: 2025.11.13 AMKOR TECH SINGAPORE HLDG PTE LTD

AI summary

In one example, an electronic device comprises a substrate including a cavity defined in an upper side of the substrate. An electronic component can be disposed over the substrate, and a lid can be disposed over the substrate and including a lid stopper in the cavity. A pedestal of the lid can be positioned over the electronic component. The lid can include a channel adjacent the pedestal. A lens can be disposed over the electronic component and on the pedestal. Other examples and related methods are also disclosed herein.