Lead Bending Alignment for Molded Electronic Sensor Assembly
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Solution Overview
Problem
Existing methods for bending lead frames in electronic devices, such as angular velocity sensors, face challenges in achieving high accuracy due to difficulties in bending leads by 90° without excessive force or deviation from the target angle.
Innovation Solution
A method involving multiple steps to bend leads by pressing a pressing member against the leads themselves, rather than the electronic components, to adjust the posture of sensor components within the device, ensuring precise alignment and minimizing return deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a mold is used to apply force from bottom to top for bending the lead by 90°, then the lead can be bent, but it is difficult to achieve high bending accuracy
Solution Approach 1:
A pressing member is introduced as an intermediary tool to bend the lead frame. The pressing member has a pressing surface that contacts the lead frame at a specific position, allowing precise control of the bending force application point and achieving accurate 90° bending without complex mold structures
Solution Approach 2:
The bending process parameters are optimized by controlling the pressing force, pressing position, and pressing member geometry. The pressing surface is designed to contact the lead frame at a specific distance from the electronic component, and the pressing force is controlled to bend the lead by exactly 90° without excessive force
2Reliability
If the pressing member presses against the electronic component during bending, then the bending can be performed, but the component may be damaged or misaligned
Solution Approach 1:
The pressing member is designed with a specific pressing surface that contacts only the lead frame at a predetermined position, not the electronic component. This localized contact ensures the lead is bent accurately while the electronic component remains undisturbed and properly aligned
Solution Approach 2:
The pressing member is positioned and configured in advance to contact the lead frame at the correct position before bending begins. This preliminary positioning ensures that the bending force is applied at the optimal point to achieve 90° bending without affecting the electronic component
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for accurate bending of leads to the target angle, reducing return deformation and ensuring precise alignment of detection axes, thereby enhancing the sensitivity and accuracy of angular velocity detection in multi-axis sensors.
Implementation Method 1
bending the first lead by pressing a pressing member against the first lead without pressing the pressing member against the first electronic component
Data Source
AI summary
A method of manufacturing an electronic device in which an electronic component coupled to a lead is covered with a mold cover, includes: a coupling step of coupling the electronic component to the lead, a bending step of bending the lead to adjust a posture of the electronic component, and a molding step of molding the electronic component with a resin material to form the mold cover, and the bending step includes a lead bending step of bending the lead by pressing a pressing member against the lead without pressing the pressing member against the electronic component.