Lead Frame Assembly for Low Inductance in Surface-Mountable Electrical Devices
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Solution Overview
Problem
Existing electrical devices with semiconductor components, such as LEDs and laser diodes, face challenges in achieving low inductance values, especially during high-current pulses, which is difficult to realize with single-layer housing concepts and printed circuit boards, leading to increased complexity and cost.
Innovation Solution
The design incorporates a lead frame assembly with multiple separate lead frames, thinned from the mounting side to reduce inductance, and a capacitor and control circuit configured for pulsed operation, allowing for direct electrical connections and a microstrip line adaptation, enabling low inductance and potentially reducing the number of printed circuit board layers by 50%.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single-layer housing concept or printed circuit board is used, then the device complexity is reduced, but the inductance value increases during high-current pulses
Solution Approach 1:
The patent transitions from a planar single-layer PCB design to a three-dimensional lead frame assembly structure. The lead frames are folded and arranged in multiple spatial dimensions, creating compact current paths that reduce inductance while maintaining a compact overall device footprint. This dimensional transformation allows complex electrical connections to be achieved within a small volume without requiring multiple PCB layers.
2Object-affected harmful factors
If multiple separate lead frames are used, then the inductance value is reduced, but the manufacturing complexity increases
Solution Approach 1:
The electrical device is divided into multiple functionally independent lead frames, each optimized for specific current paths. This segmentation allows each lead frame to be independently designed and manufactured with minimal inductance, then assembled together to form the complete device. The modular approach simplifies the manufacturing process by allowing parallel production of individual lead frames before final assembly.
Solution Approach 2:
Multiple lead frames are nested within a common housing structure, with smaller lead frames positioned within the spatial envelope of larger ones. This nesting arrangement optimizes the use of available space, allows compact current paths between nested lead frames, and simplifies the overall device assembly by integrating multiple functions into a compact three-dimensional structure.
Data Source
AI summary
A surface-mountable electrical device, an assembly including the surface-mountable electrical device, and a method for producing the surface-mountable electrical device is provided. The surface-mountable electrical device includes at least one electrical component which is a semiconductor component and which is intended for generating radiation, a control circuit for pulsed operation of the component, and a capacitor which is connected to the component electrically in series and which is configured for the pulsed energization of the component. The surface-mountable electrical device further includes a lead frame assembly having a plurality of different lead frames as a mounting platform for the component, the capacitor and the control circuit, wherein at least one of the different lead frames of the lead frame assembly is thinner than a further lead frame of the different lead frames and the lead frame assembly lies only partially in a mounting side of the device.