Lead Frame Integrated Inductor for Compact Power Packages
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Solution Overview
Problem
Current semiconductor power device packages face challenges in achieving high inductance, low DC resistance, large rated current, and cost-effectiveness while maintaining a small size, as they often require complex processing and large components like discrete inductors or MEMS-based inductors, which are costly and space inefficient.
Innovation Solution
A semiconductor power device package utilizing a lead frame with an inductor core and metal connections, such as bonding wires, to form an integrated inductor, which is protected by a molding compound, allowing for high inductance and low DC resistance in a compact and cost-effective design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a discrete inductor is used in power converter circuits, then the circuit can achieve required inductance and current handling, but the component cost increases and printed circuit board space increases
Solution Approach 1:
The patent combines the inductor and power IC into a single integrated package, eliminating the need for separate discrete inductor components on the PCB. The inductor is formed using lead frame traces and magnetic core material within the same package as the power IC, achieving both functions in one component that reduces overall board space while maintaining power conversion performance
2Volume of stationary object
If a discrete inductor is co-packaged with power IC, then package size can be reduced, but the cost increases due to duplicative assembly costs and additional component costs
Solution Approach 1:
The inductor is manufactured as an integral part of the power device package using the same lead frame and packaging process as the power IC. The lead frame traces form the inductor windings and are bonded to the power IC using the same wire bonding process, eliminating duplicative assembly steps and reducing overall manufacturing cost while achieving compact co-packaging
3Ease of manufacture
If lead frame is used as inductor element, then manufacturing is simplified, but the inductance is relatively small due to lack of magnetic core material
Solution Approach 1:
The patent uses composite construction combining lead frame traces with magnetic core material (ferrite or powder core) to create the inductor. The magnetic core material is placed within the lead frame structure and bonded to the traces, providing high permeability that significantly increases inductance while maintaining the manufacturing simplicity of lead frame-based construction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a cost-effective and space-efficient semiconductor power device package with high inductance and low DC resistance, suitable for power conversion applications, by integrating the inductor within the package, thus reducing assembly costs and board space requirements.
Implementation Method 1
an inductor core attached to the lead frame such that a plurality of lead ends are exposed through a window formed in the inductor core, a plurality of metal connections, ones of the plurality of metal connections coupling each of the plurality of lead ends to adjacent leads about the inductor core to form the inductor
Data Source
AI summary
A semiconductor power device package having a lead frame-based integrated inductor is disclosed. The semiconductor power device package includes a lead frame having a plurality of leads, a inductor core attached to the lead frame such that a plurality of lead ends are exposed through a window formed in the inductor core, a plurality of bonding wires, ones of the plurality of bonding wires coupling each of the plurality of lead ends to adjacent leads about the inductor core to form the inductor, and a power integrated circuit coupled to the inductor. In alternative embodiments, a top lead frame couples each of the plurality of lead ends to adjacent leads about the inductor core by means of a connection chip.