Lead-Frame Light Module Packaging for PCB-Less Miniaturization
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Solution Overview
Problem
Existing PCB-based light emitting devices in automotive interiors face limitations in miniaturization and cost-efficiency, with a need for improved reliability and reduced solder joints and interconnections.
Innovation Solution
A light emitting device comprising a lead frame, processing component, optical component, and encapsulating material, where the optical component is connected to the lead frame and partially encapsulated, allowing for miniaturization and enhanced reliability through a molding-based approach.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If PCB-based components are used for light emitting devices, then electrical connections and circuitry are established, but miniaturization potential is limited and costs increase
Solution Approach 1:
The patent merges the electrical connections, circuitry, and light emitting components into a single integrated PCB-less module. The lead frame structure combines mechanical support, electrical interconnections, and mounting functions, eliminating the need for separate PCB assemblies and reducing overall device size while simplifying manufacturing processes.
Solution Approach 2:
The invention extracts and eliminates the PCB component from the traditional light emitting device architecture. By removing the PCB and using the lead frame as the primary structural and electrical element, the design achieves miniaturization and reduces manufacturing complexity associated with PCB assembly and soldering.
2Reliability
If multiple solder joints and interconnections are used, then electrical connections are established, but reliability decreases and manufacturing costs increase
Solution Approach 1:
The patent combines multiple electrical interconnections into a unified lead frame structure, reducing the number of discrete solder joints. The integrated design consolidates what would traditionally require multiple separate connection points into a single cohesive component, thereby improving reliability and reducing manufacturing complexity.
3Adaptability or versatility
If components are distributed throughout vehicle interior, then lighting functions are achieved, but available space is insufficient
Solution Approach 1:
The patent merges multiple lighting functions into compact integrated modules that can be distributed throughout the vehicle interior. The PCB-less design with integrated lead frame allows these modules to occupy minimal space while maintaining full lighting functionality, enabling versatile lighting applications without consuming valuable interior space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The encapsulation-based design enhances miniaturization potential, improves cost efficiency, and increases reliability by reducing solder joints and interconnections, while enabling flexible light emission and heat dissipation.
Implementation Method 1
The encapsulating material may be a molding material. An example of the molding material may be an epoxy.
Implementation Method 2
the optical component may emit light in the spectrum that is visible for the human eye (i.e. in the range of 400 nm to 800 nm)
Data Source
Figure 1~2(c)
Figure 3(a)~3(b)
Figure 4(a)~4(d)
AI summary
A light emitting device is provided, the light emitting device comprising a lead frame, a processing component connected to the lead frame, a terminal connected to the lead frame, an optical component, and an encapsulating material encapsulating the lead frame, the processing component, and the optical component at least partially. Further, a system comprising a corresponding light emitting device and a holder is provided, wherein the light emitting device is configured for being held by the holder.