Lead Frame Mirror Sections for Optical Waveguide Coupling
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Solution Overview
Problem
Existing methods for replacing electric wiring with optical wiring face challenges in accurately disposing mirrors and forming optical waveguides close to mirror surfaces, leading to increased spacing and light signal loss.
Innovation Solution
A lead frame with monolithic mirror sections and optical waveguides, where the mirror sections are formed at 45 degrees and the optical waveguide is aligned with the mirror surface, allowing for precise optical coupling and resin sealing to minimize signal loss, enabling easy replacement of electric wiring with optical wiring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a mirror member is disposed separately on the board or formed through plating, then the mirror can be formed on the board, but it is hard to accurately dispose the mirror member or accurately set the tilt angle of the mirror
Solution Approach 1:
The mirror section is integrated into the lead frame as a monolithic structure, combining the mirror formation process with the lead frame manufacturing process. This eliminates the need for separate mirror disposal or plating operations, achieving high positioning accuracy while simplifying the overall process.
Solution Approach 2:
The mirror section is formed during the lead frame manufacturing process itself, before the optical waveguide is mounted. The lead frame is prepared in advance with the mirror sections already in their precise positions and orientations, ready for subsequent optical component assembly.
2Manufacturing precision
If the optical waveguide is formed after the mirror through resin materials with different refractive indices, then the optical waveguide can be formed, but it is impossible to form the optical waveguide close to the mirror surface portion, resulting in increased spacing and light signal loss
Solution Approach 1:
The optical waveguide mounting process is merged with the lead frame structure, allowing the optical waveguide to be directly mounted on the lead frame with the mirror sections. This integration enables the optical waveguide to be positioned extremely close to the mirror surface portion, minimizing spacing and reducing light signal loss.
Solution Approach 2:
The patent changes the manufacturing approach by forming the lead frame with integrated mirror sections first, then mounting the optical waveguide. This sequence allows for precise control of the spacing parameter between the optical waveguide end face and the mirror surface portion, optimizing light coupling efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for high-precision formation of mirrors and optical waveguides, reducing signal loss and enabling efficient optical coupling, facilitating the replacement of electric wiring with optical wiring, particularly suitable for high-speed devices like microprocessors.
Implementation Method 1
mirror surface portion inclined at an angle of about 45 degrees with respect to a planar direction of the support plate... optically couple the optical devices to the optical waveguide
Data Source
AI summary
A package for a photoelectric wiring in which a pair of light emitting and receiving devices are mounted as optical devices on a lead frame having an optical waveguide in which an optical waveguide having a plurality of core portions disposed in parallel and surrounded by a cladding is mounted on a support plate of a lead frame having a mirror section including the support plate for supporting the optical waveguide, mirror sections having a mirror surface portion formed by bending both edges of the support plate at an angle of 45 degrees with respect to a planar direction of the support plate in a side direction, and lead portions to be electrically connected to the optical devices, the support plate, the mirror sections and the lead sections being formed by pressing a metallic material, wherein the light emitting device and the light receiving device are mounted in alignment with an optical path of a light reflected by the mirror surface portion and transmitted through the core portions at one of sides and the other side which interpose the optical waveguide of the package for an optical waveguide wiring therebetween.