Semiconductor Lead Frame Incline for Resin Fill and Chip Resistance
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Solution Overview
Problem
Existing semiconductor devices face issues with package chipping and reduced durability due to inadequate resin flow during manufacturing, which affects the appearance and reliability of the device.
Innovation Solution
Incorporating an inclined portion in the lead frame design allows for improved resin flow, ensuring complete filling of the package structure and preventing chipping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If resin is injected into the package during manufacturing, then the package structure is formed, but resin flow may be inadequate causing package chipping and reduced durability
Solution Approach 1:
The lead frame is designed with an asymmetric inclined portion that slopes downward toward the resin injection gate. This asymmetric geometry creates a gravity-assisted flow path that directs resin toward the gate, ensuring complete filling of the package cavity and preventing chipping defects.
Solution Approach 2:
The lead frame incorporates a three-dimensional inclined portion with specific slope and orientation. This dimensional feature creates a gravity-driven flow path that guides resin movement during injection molding, ensuring adequate penetration and complete filling of the package structure.
2Reliability
If the lead frame has a conventional flat design, then manufacturing is simpler, but resin flow is inadequate leading to package chipping
Solution Approach 1:
The lead frame transitions from a conventional flat symmetric design to an asymmetric structure with an inclined portion. This asymmetric geometry is strategically positioned to create a gravity-assisted resin flow path, ensuring complete package filling while maintaining manufacturing feasibility.
Solution Approach 2:
The lead frame geometry is modified by introducing an inclined portion with specific slope angle and orientation. This parameter change in the lead frame structure creates a gravity-driven flow path that guides resin movement during injection molding, ensuring adequate penetration and complete filling.
3Manufacturing precision
If resin injection pressure is increased to improve filling, then completeness improves, but package chipping risk increases due to stress
Solution Approach 1:
The lead frame is pre-designed with an inclined flow path that passively guides resin movement during injection. This preliminary structural arrangement creates a gravity-assisted flow channel that directs resin toward the gate without requiring excessive injection pressure, thereby preventing stress-induced chipping while ensuring complete filling.
Solution Approach 2:
The inclined portion of the lead frame acts as an intermediary flow channel between the resin injection point and the package cavity. This intermediate structure creates a controlled flow path that manages resin movement, ensuring complete filling while distributing stress evenly to prevent chipping.
Data Source
AI summary
A semiconductor chip includes a first electrode provided farther in a first direction than the first lead frame and is electrically coupled to a first lead frame, and a second electrode. A first conductor electrically coupled to the second electrode. A second lead frame is aligned with the first lead frame at a position farther in a second direction than the first lead frame and includes a first terminal and a plate portion connected to the first terminal. The plate portion is electrically coupled to the first conductor and has an inclination over a first surface on a side in the first direction and a first side surface on a side in the second direction. A resin covers a part of the first lead frame, the semiconductor chip, the first conductor, and the plate portion and a part of the first terminal.