Lead Frame Stiffening Structure for Stable Chip Anchoring
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing optoelectronic components require frequent re-design of housings due to changing application requirements, and existing production methods lack flexibility in mechanical and electrical fixation of semiconductor chips.
Innovation Solution
An optoelectronic component with a lead frame section and a stiffening structure embedded in an electrically insulating housing, where the stiffening structure connects to another lead frame section and includes a line element for improved mechanical fixation and flexible electrical contacting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a simple conductor frame section is used, then the device complexity is reduced, but the mechanical fixation stability of the semiconductor chip deteriorates
Solution Approach 1:
The conductor frame is divided into multiple conductor frame sections (first conductor frame section, second conductor frame section, etc.) that are connected to each other. Each section can be independently designed and manufactured, then assembled to form the complete frame structure. This segmentation allows the frame to achieve both structural stability for mechanical fixation and design flexibility without excessive complexity.
2Reliability
If the housing design is optimized for specific applications, then the mechanical fixation is improved, but the adaptability to changing requirements deteriorates
Solution Approach 1:
The conductor frame sections are designed with universal features that allow them to serve multiple functions: providing mechanical support, enabling electrical connections, and facilitating thermal management. The standardized sections can be configured in different arrangements to meet various application requirements, making the housing design adaptable without sacrificing mechanical fixation quality.
3Reliability
If conductor frame sections are embedded in housing, then the electrical insulation is improved, but the ease of manufacture deteriorates
Solution Approach 1:
The conductor frame sections are pre-assembled and prepared with necessary electrical connections and semiconductor chip mounting positions before being embedded in the housing. This preliminary preparation allows for quality control and assembly verification to be performed on the frame sections independently, simplifying the final embedding process and improving overall manufacturability while maintaining electrical insulation.
Data Source
Figure 1
Figure 2
Figure 3
AI summary
The invention relates to an optoelectronic component having at least one optoelectronic semiconductor chip, wherein the at least one optoelectronic semiconductor chip is arranged on a top side of a lead frame section (9), wherein the lead frame section (9) has a stiffening structure protruding away from the lead frame section (9) laterally, and wherein the lead frame section (9), the stiffening structure, and the at least one optoelectronic semiconductor chip are embedded in an electrically insulating housing.