Lead Frame Package With Through-Hole Resin Injection
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Solution Overview
Problem
Conventional methods for manufacturing light emitting devices result in thick packages due to resin injection from the back side of lead frames, requiring unnecessary bending and increasing the thickness of the devices.
Innovation Solution
A method involving a lead frame with through-holes at the package formation region, where resin is injected between clamped electrodes, cured, and the injection opening is cut away, allowing for a thinner package structure without the need for lead bending.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If resin is injected from the back side of the lead frame, then the package can be manufactured, but the package becomes thick
Solution Approach 1:
Instead of injecting resin from the back side of the lead frame as in conventional methods, this patent inverts the approach by injecting resin from the front side through an injection opening formed in the lead frame. This inversion allows the resin to flow and cure in a manner that produces a thinner package structure while maintaining manufacturability.
Solution Approach 2:
The patent changes the dimensional approach by forming an injection opening in the lead frame structure itself, allowing resin injection from a different spatial dimension (front side rather than back side). This dimensional change enables the resin to distribute more efficiently and cure to form a thinner package.
2Ease of operation
If the lead frame is bent to form the light emitting device, then the device can be assembled, but the manufacturing process becomes complex
Solution Approach 1:
The patent performs preliminary actions during the resin injection and curing process itself. The resin is injected through openings in the lead frame, cures to bond components, and then the injection openings are closed, all before final device assembly. This eliminates the need for subsequent bending operations that would otherwise be required to assemble the device.
Solution Approach 2:
The patent merges multiple functions into the resin injection process: the resin serves as both the bonding agent and the structural forming medium. By injecting resin through openings in the lead frame and curing it in place, the process combines component assembly, bonding, and structural formation into a single operation, eliminating separate bending and assembly steps.
3Ease of manufacture
If resin is injected from the back side, then the package can be formed, but the light emitting device thickness increases
Solution Approach 1:
The patent inverts the conventional resin injection approach by injecting from the front side through lead frame openings rather than from the back side. This inversion causes the resin to flow and cure in a pattern that minimizes package thickness while maintaining ease of formation.
Solution Approach 2:
The patent applies local quality by forming injection openings at specific locations in the lead frame where resin injection will most effectively produce a thin package structure. The openings are strategically positioned to control resin flow and curing patterns, creating local variations in package structure that optimize overall thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the manufacture of thinner packages and light emitting devices with improved heat dissipation and reduced manufacturing time, as the resin injection opening becomes unnecessary after curing, and eliminates the need for lead bending.
Implementation Method 1
curing or solidifying the injected first resin
Data Source
AI summary
A method for manufacturing a package includes: preparing a lead frame that, in a region where the package is to be formed, has first and second electrodes, and has a through-hole at a position that spans across outer edges of the region; clamping the first and second electrodes between upper and lower molding dies; injecting a first resin into the molding dies, through an injection opening formed adjacent to the first electrode and on the outside of the region, so that the first resin has a wall that constitutes a side wall of a bottomed concave component with an outer lead component protruding outward from the wall, and a height of the side wall is larger than a thickness of the outer lead component; curing or solidifying the injected first resin; and cutting out an injection mark by cutting the lead frame at the outer edges of the region.