Lead Frame Y-Axis Extension for High Withstand Voltage
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Solution Overview
Problem
Semiconductor devices face a challenge in increasing withstand voltage without expanding their outside dimensions, which can lead to increased manufacturing costs and reduced productivity due to the need for design and process changes in circuit boards.
Innovation Solution
A lead frame configuration with a die pad portion, first and second lead portions, and extension portions is used, where the lead portions are arranged in specific directions to allow for increased distances between terminal portions while maintaining the device's dimensions, enabling higher withstand voltage without increasing the device's size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the distance between terminal portions is increased to improve withstand voltage, then the withstand voltage is improved, but the outside dimension of the device increases
Solution Approach 1:
The patent applies dimensionality change by extending lead portions in the Y-axis direction (perpendicular to the X-axis arrangement of terminals) to increase the effective distance between terminals for withstand voltage purposes, while maintaining the X-axis footprint. The extension portions project outward from the die pad in the Y-direction, allowing increased electrical clearance without increasing the device's width or length in the plane of the circuit board.
2Reliability
If the outside dimension is increased to improve withstand voltage, then the withstand voltage is improved, but the manufacturing cost increases due to design changes in circuit boards
Solution Approach 1:
The invention resolves the manufacturing cost issue by extending lead portions in the Y-axis direction rather than increasing the X-axis footprint. This dimensional approach allows the device to achieve higher withstand voltage while maintaining compatibility with existing circuit board designs and manufacturing processes, as the overall package dimensions remain unchanged.
3Reliability
If the outside dimension is increased to improve withstand voltage, then the withstand voltage is improved, but the productivity decreases due to process changes
Solution Approach 1:
The patent maintains productivity by implementing the withstand voltage improvement through Y-axis extensions of lead portions rather than increasing the X-axis device footprint. This approach allows existing assembly and mounting processes to continue unchanged, as the device occupies the same space on the circuit board while providing enhanced electrical isolation through the extended lead portions in the perpendicular direction.
Data Source
AI summary
A lead frame is provided with a die pad portion, a first lead portion, a second lead portion, and an extension portion extending from a corner portion neighborhood of the die pad portion to the outside of the die pad portion. The first lead portion has a first terminal portion and a first lead post portion positioned on a side closer to the die pad portion relative to the first terminal portion and electrically connected to the first terminal portion. The second lead portion has a second terminal portion, a third terminal portion positioned between the first terminal portion and the second terminal portion, and a second lead post portion positioned on a side closer to the die pad portion relative to the second terminal portion and the third terminal portion and electrically connected to the second terminal portion and the third terminal portion.