Leadframe Grid Array for IC Package Connectivity
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Solution Overview
Problem
Current integrated circuit package systems face challenges in providing improved connectivity and cost-effectiveness while maintaining smaller product sizes, as the traditional leadframe structure limits the number of unique connections due to lead fingers being formed around the outside edge of the die attach pad.
Innovation Solution
The integrated circuit package system employs a lead grid with lead blocks and interposers, where the lead blocks are connected to the interposers using fuse interconnects, allowing for improved interconnect routing and increased connectivity by eliminating interconnect crossing and providing lower costs through leadframe technology.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If lead fingers are formed around the outside edge of the die attach pad in a traditional leadframe structure, then manufacturing simplicity is maintained, but the number of unique connections is significantly limited
Solution Approach 1:
The leadframe structure is segmented into multiple independent lead blocks arranged in a grid pattern, replacing the traditional single continuous lead finger structure. This segmentation allows each lead block to serve as an independent connection point, significantly increasing the number of unique connections from the traditional 4-8 connections to potentially 16 or more connections while maintaining manufacturing simplicity through standardized grid-based fabrication processes
Solution Approach 2:
The leadframe structure transitions from a one-dimensional arrangement of lead fingers around the perimeter to a two-dimensional grid array of lead blocks. This dimensional change enables connections to be distributed across the entire footprint of the die attach pad rather than being constrained to the perimeter, effectively doubling or tripling the number of available connection points without increasing the overall package size
2Volume of moving object
If the product size is reduced to meet consumer demands for smaller electronic products, then portability and space efficiency are improved, but the number of connections that can be provided is reduced
Solution Approach 1:
By transitioning from perimeter-based lead fingers to a two-dimensional grid array, the connection density is dramatically increased within the same footprint. This allows smaller package sizes to maintain or even increase the number of connections compared to traditional designs, as the grid structure utilizes the entire available area rather than just the perimeter
Solution Approach 2:
The leadframe geometry parameters are changed from long narrow lead fingers to compact square or rectangular lead blocks arranged in a grid. This parameter change allows for more efficient space utilization and enables higher connection counts in smaller form factors by optimizing the spatial distribution of connection points
3Adaptability or versatility
If more connections are provided to meet growing market demand, then connectivity and functionality are improved, but cost increases
Solution Approach 1:
The grid-based segmentation provides a modular approach where additional connections are achieved by adding more standardized lead blocks rather than customizing complex lead finger configurations. This modular scalability allows manufacturers to increase connection counts in standardized increments, maintaining economies of scale and avoiding the cost premiums associated with custom high-density interconnect solutions
Solution Approach 2:
The grid leadframe structure serves multiple functions simultaneously: it provides mechanical support, electrical interconnection, and thermal management pathways. This multi-functionality reduces the need for additional separate components or complex routing structures that would increase cost, as the same grid architecture fulfills multiple system requirements
Data Source
AI summary
An integrated circuit package system includes providing an integrated circuit die; attaching the integrated circuit die over a lead grid having lead blocks; and connecting a die interconnect to the integrated circuit die and the lead blocks.