Leadframe Pocket for Transceiver Thermal Management
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Solution Overview
Problem
Electronic devices, particularly optical transceivers, generate excessive heat as operational frequencies increase, leading to component failure, and existing package structures are inadequate in managing this heat effectively.
Innovation Solution
A package structure using a Printed Circuit Board (PCB) with a pocket to house a thermally-split leadframe, which supports and dissipates heat from both semiconductor and optical components, allowing for efficient heat removal and reduced noise by minimizing wire length.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If operational frequency is increased to achieve higher data rates, then productivity is improved, but temperature increases causing component failure
Solution Approach 1:
The patent extracts the heat-generating semiconductor die from the main circuit board and places it in a separate leadframe assembly with dedicated thermal management. The die is mounted on a leadframe that is thermally coupled to a heat sink, separating the heat generation source from the main PCB structure to enable independent thermal management.
Solution Approach 2:
The patent introduces an intermediary thermal management structure consisting of the leadframe and heat sink assembly. This intermediary structure acts as a thermal bridge between the semiconductor die and the external environment, facilitating heat transfer without requiring direct modification of the high-speed circuit board.
2Ease of manufacture
If traditional package structures are used, then ease of manufacture is maintained, but heat dissipation capability is insufficient
Solution Approach 1:
The patent segments the package structure into distinct functional modules: the leadframe assembly containing the semiconductor die and heat sink, and the separate circuit board. This segmentation allows each module to be optimized independently for its specific function while maintaining overall manufacturing efficiency through modular assembly.
Solution Approach 2:
The leadframe serves multiple functions simultaneously: it provides mechanical support for the semiconductor die, establishes electrical connections through its leads, and acts as a thermal conduction path to the heat sink. This multi-functionality reduces the need for additional separate components, maintaining ease of manufacture.
3Temperature
If heat dissipation structures are added to manage thermal load, then temperature is controlled, but device complexity increases
Solution Approach 1:
The patent merges the electrical connection function and thermal management function into a single integrated leadframe assembly. The leadframe leads provide both electrical connectivity and thermal conduction pathways, eliminating the need for separate thermal interface materials or additional heat sinking components that would increase complexity.
Solution Approach 2:
The leadframe is constructed from composite materials that simultaneously provide electrical conductivity and thermal conductivity. This use of composite materials allows a single component to fulfill multiple functional requirements, reducing overall device complexity while maintaining effective heat management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables optical transceivers to operate at higher speeds without heat-induced failure, maintaining component reliability and reducing system noise through effective heat management and compact design.
Implementation Method 1
the leadframe sections may also operate as heat sinks for the components by carrying heat away from the transceiver components
Data Source
AI summary
A package structure and methods of manufacturing the same are disclosed. The package structure corresponds, in one example, to a transceiver module having a substrate with a pocket formed therein. The pocket is configured to receive one or multiple parts of a leadframe and helps reduce the amount of wire bonding required to connect the leadframe or components mounted thereon to traces on the substrate.