Leadframe Segmentation for High Density IC Packages

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Solution Overview

Problem

Modern consumer electronics require increased integrated circuit density within shrinking physical spaces while maintaining cost reduction, but existing technologies fail to effectively address higher lead densities and printed circuit board complexity.

Innovation Solution

The integrated circuit package system involves forming a leadframe with a frame and die paddle, separating leads from the die paddle, bonding wires between the leads and die, encapsulating the die and wires, and singulating the leadframe to create a compact package with enhanced lead density.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If integrated circuit content increases in a package, then more functions are provided, but input and output density increases creating PCB complexity and congestion

Engineering Contradiction:

Improveintegrated circuit contentVSAvoidprinted circuit board complexity

Core Design Contradiction:

Quantity of substanceVSDevice complexity

Solution Approach 1:

The leadframe is divided into separate components: the frame structure and the die paddle with leads are singulated as independent elements. This segmentation allows the leads to be precisely positioned and spaced, reducing PCB routing complexity while maintaining high I/O density

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Multiple rows of leads are arranged in a two-dimensional grid pattern on the die paddle, transitioning from traditional single-row configurations. This dimensional change increases I/O density without proportionally increasing PCB complexity by optimizing spatial utilization

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Quantity of substance

If more integrated circuits are packed into shrinking physical space, then consumer electronics requirements are met, but package dimensions increase

Engineering Contradiction:

Improveintegrated circuit densityVSAvoidpackage dimensions

Core Design Contradiction:

Quantity of substanceVSArea of stationary object

Solution Approach 1:

The die is mounted on the die paddle within the leadframe structure, creating a nested arrangement where the active component is housed within the support structure. This nesting optimizes space utilization and reduces overall package footprint

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The lead spacing and arrangement parameters are optimized with multiple rows of closely-spaced leads on the die paddle. This parameter optimization increases I/O density while controlling package dimensions by efficiently utilizing the available footprint area

Inventive Principle:

Principle #35Parameter changes

3Area of stationary object

If lead density is increased to reduce package size, then space requirements are reduced, but manufacturing complexity increases

Engineering Contradiction:

Improvepackage sizeVSAvoidmanufacturing complexity

Core Design Contradiction:

Area of stationary objectVSEase of manufacture

Solution Approach 1:

The leads are pre-formed and attached to the die paddle before the die mounting process. This preliminary action simplifies subsequent manufacturing steps by having the lead structure ready for integration, reducing overall manufacturing complexity despite high lead density

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The frame and die paddle are combined into an integrated leadframe structure that is singulated as a single unit. This merging simplifies manufacturing by reducing the number of separate components that need to be handled and assembled, even with multiple rows of leads

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS8278148B2Integrated circuit package system with leads separated from a die paddle

Publication Date: 2012.10.02 STATS CHIPPAC LTD

AI summary

An integrated circuit package system is provided including forming a leadframe having a frame and a die paddle having leads thereon. The leads are held with respect to the die paddle. The leads are separated from the die paddle, and a die is attached to the die paddle. Bond wires are bonded between the leads and the die. The die and bond wires are encapsulated. The leadframe is singulated to separate the frame and the die paddle.