Leadless Wiegand Module Integrated Coil Design
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Solution Overview
Problem
Existing Wiegand module systems face challenges in signal accuracy and assembly complexity due to the structure and lead connections, which affect the electrical signal quality and mechanical reliability.
Innovation Solution
A leadless Wiegand module design where the Wiegand module is mounted directly to a substrate without separate leads, using a core structure with a coil and ferromagnetic element, and a semiconductor die with integrated counter circuitry, processor, and memory, which simplifies assembly and enhances signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If separate leads are used to connect the Wiegand module to the substrate, then electrical connection is established, but signal accuracy deteriorates and assembly complexity increases
Solution Approach 1:
The patent merges the Wiegand module directly with the substrate by eliminating separate leads. The coil structure is integrated onto the substrate surface, and the Wiegand wire is positioned in direct contact with the coil, creating a unified structure that reduces assembly steps and improves signal fidelity by removing intermediate connection points.
Solution Approach 2:
The patent extracts and eliminates the separate leads from the system. By removing the lead connections between the Wiegand module and substrate, the design reduces signal interference and assembly complexity while maintaining electrical connectivity through direct integration of the coil structure onto the substrate.
2Volume of moving object
If leads are used for connection, then electrical connectivity is achieved, but the structure becomes less compact and mechanical reliability decreases
Solution Approach 1:
The patent combines the Wiegand module components into a compact integrated structure where the coil is formed directly on the substrate and the Wiegand wire is positioned in direct contact with the coil. This eliminates the need for separate leads and mounting hardware, reducing overall volume while improving mechanical reliability through fewer connection points.
3Manufacturing precision
If a traditional Wiegand module structure with leads is used, then assembly is possible, but signal transmission quality deteriorates
Solution Approach 1:
The patent merges the Wiegand module structure directly with the substrate, eliminating leads and reducing the number of assembly steps. The coil is formed on the substrate surface and the Wiegand wire is positioned in direct contact, simplifying manufacturing while improving signal transmission quality by removing intermediate connection points that cause signal degradation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The leadless design improves signal accuracy and reduces assembly complexity by eliminating the need for separate leads, resulting in a more compact and reliable Wiegand module system.
Implementation Method 1
a ferromagnetic element (200) that extends along the coil axis such that the ferromagnetic element is magnetically coupled to the coil (205)
Implementation Method 2
The Wiegand effect is a nonlinear magnetic effect caused by the presence of a magnetic field near a Wiegand wire
Data Source
AI summary
A package comprises a body having a mounting surface so as to be mounted to an external surface, and a coil having at least 100 turns around a coil axis. A first end of the coil is oriented in a first direction substantially parallel to the mounting surface such that the first end is attachable to the external surface. The package includes a ferromagnetic element that extends along the coil axis such that the ferromagnetic element is magnetically coupled to the coil. The body is configured to house the coil and the ferromagnetic element.