LED Assembly Fabrication Using Anisotropic Conductive Film
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Solution Overview
Problem
The conventional process of removing LED chips from a temporary carrier film and fixing them to a base is time-consuming, hindering the efficiency of LED assembly fabrication.
Innovation Solution
A method involving a transparent carrier with printed circuits and an anisotropic conductive film, where LED chips are simultaneously bonded to the carrier and then separated from the temporary carrier, simplifying the process and improving throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If LED chips are removed one by one from temporary carrier film and fixed to base individually, then precise positioning and electrical connection can be achieved, but fabrication time and process complexity increase significantly
Solution Approach 1:
The patent merges multiple LED chips onto a single permanent carrier substrate simultaneously, rather than transferring them individually. The permanent carrier substrate integrates both mechanical support and electrical connection functions, allowing multiple chips to be processed together as one unit, thus improving throughput while maintaining positioning precision through the substrate's structured design.
Solution Approach 2:
The patent performs preliminary actions by pre-attaching multiple LED chips to the permanent carrier substrate before final assembly. The chips are positioned and electrically connected in advance on the carrier substrate, which then serves as a pre-assembled unit for further integration, eliminating the need for individual chip handling during final assembly.
2Reliability
If conventional individual chip transfer process is used, then each chip can be inspected and positioned separately, but the fabrication process becomes time-consuming and complex
Solution Approach 1:
The patent combines multiple chip inspection and positioning operations into a single batch process. Multiple LED chips are transferred and positioned on the permanent carrier substrate simultaneously in one operation, rather than being handled individually through separate steps, thus reducing process complexity while maintaining inspection quality through group verification.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the simultaneous bonding and separation of multiple LED chips, significantly simplifying fabrication steps and enhancing production efficiency by eliminating the need for individual chip transfer, thereby improving the LED assembly fabrication process.
Implementation Method 1
an anisotropic conductive film is formed on the transparent carrier
Data Source
AI summary
Disclosed embodiments include a manufacturing method for an LED assembly. Providing a first carrier, wherein several LED chips are formed on the first carrier, and providing a second carrier. Attaching the second carrier to the LED chips and detaching the first carrier from the LED chips but leaving the LED chips on the second carrier.