Thermally Conductive Adhesive Layer for LED Heat Dissipation
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Solution Overview
Problem
LED luminaires face issues with heat dissipation and component replacement due to integrated designs, leading to manufacturing cost concerns from non-standardized parts in mass production.
Innovation Solution
A lighting device with a thermally conductive adhesive layer directly contacting the light emitting chip and a base, eliminating the need for a circuit board and using standardized LED components with a frame for easy assembly and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If all components are integrated into the luminaire, then the luminaire structure is compact, but it becomes difficult to replace failed components and requires replacing the entire luminaire
Solution Approach 1:
The LED component is segmented as a separate replaceable module that can be independently removed and replaced. The LED component includes the LED chip, light support, and packaging unit as an integrated sub-assembly, while the heat sink and driver remain as separate replaceable components. This segmentation allows individual component replacement without replacing the entire luminaire.
2Adaptability or versatility
If multiple non-standardized parts are used in LED luminaires, then the luminaire can be assembled with different components, but the manufacturing cost remains high due to lack of standardization for mass production
Solution Approach 1:
The LED component is designed as a universal module with standardized interfaces that can be applied across different luminaire types. The base structure with threaded hole, standardized heat sink mounting interface, and common electrical connections enable the same LED component design to be used in various luminaire applications, facilitating mass production and reducing manufacturing costs.
3Temperature
If heat dissipation path includes multiple components (chip, light support, circuit board, thermally conductive material, heat sink), then heat can be dissipated, but the thermal resistance is large
Solution Approach 1:
The LED chip is directly mounted on the heat sink through the base structure, merging the light support and heat dissipation functions into a more direct thermal path. The circuit board is positioned to conduct heat from the LED chip to the heat sink, creating multiple parallel heat dissipation paths that reduce overall thermal resistance compared to sequential heat transfer through multiple separate components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation and reduces manufacturing costs by allowing for standardized components and easier assembly, while enabling independent replacement of LED components.
Implementation Method 1
a thermally conductive adhesive layer, the thermally conductive adhesive layer has opposite sides directly, which contact the light emitting chip and the base, respectively
Data Source
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AI summary
A lighting device includes a base, at least one light emitting chip, at least one optical member covering the light emitting chip, and a thermally conductive adhesive layer. The thermally conductive adhesive layer has opposite sides directly contacting the light emitting chip and the base, respectively.