Planar Light Sources TRIZ Cases

Segmented connectors with bendable members eliminate soldering, resolving manufacturing efficiency and heat dissipation trade-offs.

Segmented diode supports and reversible sealing covers resolve moisture resistance versus maintenance complexity in luminous vehicle glazing.

Segmented end wall absorbs thermal expansion differences between metal inserts and plastic profiles to maintain sealing reliability.

Laminated films protect sensitive surface lighting elements from mechanical stress and corrosion while maintaining homogeneous current density distribution.

A ring presses the LED light source module onto a heat sink to secure the assembly without screws.

Electronic control of segmented light sources varies illumination spot size without mechanical parts, eliminating power loss from distance changes.

Segmented shielding structures suppress optical crosstalk between closely spaced elements while minimizing dark regions and preserving extraction efficiency.

Dual lens engagement secures LED tape light against adhesive failure in vertical installations.

Out-of-phase synthetic jets cancel acoustic noise while maintaining cooling efficiency for LED systems.

A light-collecting plate with a micro lens array concentrates diffused LED radiation to direct illumination paths.

Segmented LED chips with separate switches resolve high production costs from remote controls, enabling stable multi-temperature output.

An array of individually controllable light-output devices projects light through an optical system to form a patterned spot array.

An integrated aluminum heat sink manages thermal energy from series-connected LED chips, increasing light output while reducing device complexity.

High thermal conductivity covers dissipate heat from LED arrays, resolving brightness and temperature trade-offs.

Segmented heat sink design inhibits perimeter heat transfer to resolve flush installation thermal constraints.

Segmented housing zones resolve the contradiction between versatile uplighting capability and device complexity by applying local quality principles.

Lens units refract light beams from light-emitting subunits into distinct paths, resolving incomplete rear-right and rear-left visibility.

A lighting device integrates general illumination and beneficial wavelength sources into a single unit using an optical integrating cavity.

Curved base lines on the prism panel surface eliminate flat gaps between elements, resolving manufacturing flexibility issues while reducing glare.

A composite adhesive film bonds a light guide plate to a reflective plate, suppressing vibration-induced wear and display quality reduction.

A luminaire positions a wireless transmission module laterally to preserve light output while enabling signal transfer.

A thermally conductive adhesive layer bonds the light emitting chip directly to the base structure.

Prism slope angles between 5 and 45 degrees control high-angle light exit, reducing glare without increasing luminaire count.

A stepped first conductive semiconductor layer distributes mechanical stress during substrate separation.

Segmented power traces enable layout flexibility for cuttable light-emitting assemblies while maintaining continuous electrical connections.

A multi-dimensional light-emitting device combines blue LED arrays and red-green diodes to produce mixed illumination.

Segmented optical cells resolve complexity trade-offs by enabling versatile luminaire configurations through standardized component assembly.

Interchangeable LED modules on a power plate resolve adaptability trade-offs by enabling flexible configuration of light distribution and color temperature.

Nanoparticle coating on LED circuit boards accelerates heat radiation and prevents corrosion while managing thermal accumulation.

A battery-operated LED bulb uses a nonconductive threaded base to accept power from a separate charging unit.

An LED luminaire applies local quality and segmentation to match cow eye sensitivity, reducing energy waste from uneven HID lamp distribution.

Integrating connecting portions into the housing eliminates external tripods, expanding illumination range while reducing structural complexity.

A lighting module arranges red, green, and blue LEDs on a circuit board based on heat generation to manage thermal load.

Segmented junction box cover extends into finished ceiling space to house utility structures, resolving volume constraints in low-clearance installations.

A hybrid LED merges narrow color-band and wide color-band light sources to boost luminous intensity while maintaining strict spectral purity.

Segmented LED grids with 4-16 mm pitch reduce discomfort glare while maintaining optical efficiency.

A series of optical diffusers redirects input signals to form an enlarged extended source with reduced speckle noise.

A single conductive structure merges lamp holder and light source board electrical paths, eliminating sequential wire welding steps.

Integrated case body with heat sink transfers thermal energy from light emitting module while flexible barrier prevents moisture ingress.

Asymmetric chip positioning and tapered films increase side emission intensity, eliminating dark areas between adjacent LEDs.

A radiator vent channels longitudinal airflow through the optical module plate to circulate cooling air near the light source.

Integrating functional circuit modules into the lamp base eliminates the need for additional mounting space, resolving prior art complexity.

Conductive epoxy inserts through flexible cable openings create reliable electrical connections that maintain panel flexibility and hermetic sealing.

Interleaved LED grids paired with refractive lenses achieve homogeneous color mixing at reduced lamp depth without visible color contours.

Varying pixel shapes compensate for optical distortion, reducing surface area while maintaining spatial resolution in illumination regions.

A monolithic headlight lens uses light tunnels to guide illumination through transparent material.

Auxiliary surface light source maintains night signature visibility without increasing production complexity or cost.

Spiral UV irradiation units cure optical fiber resin coatings, preventing adhesion and waviness from incomplete polymerization.

Domed luminescent converting appliances separate phosphors from LEDs, reducing thermal degradation while maintaining uniform color rendering.