Retrofit Lamp Ring Presses LED Module onto Heat Sink
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Solution Overview
Problem
Existing LED retrofit lamps face high component and assembly costs due to screw connections, which also reduce insulation sections and compromise electrostatic discharge compatibility.
Innovation Solution
A retrofit lamp design featuring a heat sink with a light source module and a ring that laterally surrounds and presses the light source module onto the heat sink, eliminating the need for screw connections and allowing for improved insulation and electrostatic discharge compatibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If screw connections are used to press the light source module onto the heat sink, then the connection strength is improved, but the component and assembly costs increase and insulation sections are reduced
Solution Approach 1:
The patent removes the screw connection elements from the system and replaces them with a ring structure that provides the necessary pressing force through its elastic deformation, thereby eliminating complex assembly components while maintaining connection strength
Solution Approach 2:
The ring structure utilizes its own elastic properties to provide the pressing force needed to secure the light source module to the heat sink, eliminating the need for external fastening mechanisms like screws and reducing assembly complexity
2Strength
If screw connections are used to press the light source module onto the heat sink, then the connection strength is improved, but the insulation sections are reduced
Solution Approach 1:
The patent removes the screw connection elements that create insulation issues and replaces them with a ring structure that provides uniform pressing force without compromising insulation sections, thereby eliminating the harmful effect while maintaining connection strength
3Strength
If screw connections are used to press the light source module onto the heat sink, then the connection strength is improved, but the electrostatic discharge compatibility is compromised
Solution Approach 1:
The patent removes the screw connection elements that compromise electrostatic discharge compatibility and replaces them with a ring structure that provides uniform pressing force while maintaining ESD compatibility, thereby eliminating the reliability issue while maintaining connection strength
4Temperature
If thermal conductive adhesives or heat-conductive paste are used between the light source module and heat sink, then the heat transfer effectiveness is improved, but the component and assembly costs increase
Solution Approach 1:
The patent removes the thermal conductive adhesives or paste from the system and relies on the direct mechanical contact and pressing force from the ring structure to achieve effective heat transfer, thereby eliminating additional components while maintaining thermal management performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly reduces component and assembly costs while enhancing insulation and electrostatic discharge compatibility, allowing for a compact and efficient heat transfer without adhesives, thus improving the overall performance and reliability of the retrofit lamp.
Implementation Method 1
thermal conductive adhesives, thermal conductive foils or heat-conductive paste for generating an effective heat transfer from the light source module to the heat sink
Implementation Method 2
the ring can easily exert a defined pressing force on the light source module, in particular on its circuit board
Data Source
AI summary
A retrofit lamp comprises a heat sink, a light source module with a circuit board, whose rear side lies two-dimensionally on the heat sink and at the front side of which at least one semiconductor light source is arranged, and a ring partially covering the front side of the light source module, wherein the ring presses the light source module onto the heat sink. A method serves for producing a retrofit lamp, wherein the rear side of the circuit board of the light source module is laid on the heat sink and the ring is put on the retrofit lamp from the front such that it presses the light source module onto the heat sink. The invention is particularly applicable to LED retrofit lamps for replacing conventional light bulbs or halogen lamps.