LED Circuit Board Nanoparticle Coating for Heat Dissipation

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Solution Overview

Problem

LED lamp tubes face heat dissipation challenges, leading to high temperatures on circuit boards that can damage electrical components and increase maintenance costs, and are susceptible to short circuits and corrosion.

Innovation Solution

A heat dissipating structure for LED circuit boards featuring a coating layer composed of nanoparticles and a bonding agent applied to soldering points, enhancing heat dissipation efficiency, durability, and resistance to water, oxidation, and corrosion, with additional heat dissipation holes in the lamp tube.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Duration of action of moving object

If LEDs are used in lamp tubes, then power consumption is reduced and service time is extended, but heat accumulation occurs on the circuit board which can destroy electrical components

Engineering Contradiction:

Improveservice timeVSAvoidheat accumulation

Core Design Contradiction:

Duration of action of moving objectVSTemperature

Solution Approach 1:

The patent applies parameter changes by coating the circuit board with a special material that alters its thermal properties. This coating changes the heat dissipation parameters of the circuit board, enabling it to effectively release accumulated heat while maintaining the long service time benefit of LEDs.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses composite materials by combining the circuit board with a specialized coating layer that has superior heat dissipation properties. This composite structure allows the circuit board to maintain electrical functionality while improving thermal management to prevent component destruction.

Inventive Principle:

Principle #40Composite materials

2Duration of action of stationary object

If heat dissipation is improved, then component durability increases, but the circuit board becomes vulnerable to water infiltration and corrosion

Engineering Contradiction:

Improvecomponent durabilityVSAvoidwater infiltration

Core Design Contradiction:

Duration of action of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The patent applies flexible shells and thin films by using a coating layer that forms a protective barrier on the circuit board surface. This thin film structure prevents water infiltration and corrosion while allowing the heat dissipation functionality to remain effective, thus protecting components without compromising thermal management.

Inventive Principle:

Principle #30Flexible shells and thin films

3Reliability

If a coating layer is applied to the circuit board, then water resistance and oxidation resistance are improved, but the heat dissipation area is reduced

Engineering Contradiction:

Improvewater resistanceVSAvoidheat dissipation area

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent applies parameter changes by selecting a coating material and thickness that optimizes the balance between protection and heat dissipation. The coating parameters are controlled to maintain sufficient water resistance while preserving adequate thermal conductivity for effective heat dissipation.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses composite materials by creating a multi-layer structure where the coating layer provides protection against water and oxidation, while the underlying circuit board structure maintains the heat dissipation area. The composite design allows both protective and thermal functions to coexist.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively accelerates heat dissipation, increases the lifespan of LED circuit boards by preventing short circuits and corrosion, and reduces maintenance costs through improved heat radiation and resistance properties.

Implementation Method 1

The coating layer is composed of Nanoparticles and a bonding agent... effectively accelerates heat dissipation, prevents short circuits, and increases the durability and service life of LED circuit boards by improving heat radiation coefficients

Methodology Applied

Scientific EffectHeat radiation: Thermal Radiation

Implementation Method 2

The lamp tube has a plurality of heat dissipation holes disposed on the left and right sides of the tube. The heat dissipating holes face toward the heat dissipating surface of the LED circuit board

Methodology Applied

Scientific EffectHeat convection: Convection

Data Source

PatentUS8764222B2Heat dissipating structure of LED circuit board and LED lamp tube comprised thereof

Publication Date: 2014.07.01 KITAGAWA HOLDINGS LLC

AI summary

A heat dissipating structure of an LED circuit board includes an LED circuit board having a plurality of soldering points. The soldering points of the LED circuit board are covered by a coating layer including Nanoparticles and a bonding agent. The coating layer has the characteristics of high emitting rate, temperature resistance, and conductivity insulation. On the other hand, the coating layer can increase the contacting areas of the soldering points with the air to enlarge the heat dissipation area of the LED circuit board. The LED circuit board covered by the coating layer is placed in an LED lamp tube to provide good heat dissipation effect.