LED Lighting Device Thermal Dissipation and Moisture Protection
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Solution Overview
Problem
Conventional lighting devices using LEDs face challenges in heat dissipation and moisture protection, which affect their reliability and maintenance, particularly in outdoor applications where thermal management and environmental exposure are concerns.
Innovation Solution
The design incorporates a case body with heat dissipating features, a heat sink, and a protective ring structure that includes a gap member and lens configuration to enhance thermal dissipation and prevent moisture ingress, along with a coupling mechanism for easy maintenance and attachment to external support members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional lighting device structure is used, then the device is simple in structure, but heat dissipation is insufficient affecting reliability
Solution Approach 1:
The case body integrates multiple functions: it serves as the structural housing, incorporates heat dissipation fins for thermal management, and includes mounting features for securing the device. This merging of structural support and heat dissipation functions into a single integrated component improves reliability without proportionally increasing complexity.
Solution Approach 2:
The case body is designed as a multi-functional component that simultaneously provides mechanical protection, thermal management through integrated fins, and mounting capability. This universal design approach allows a single component to address multiple requirements (structural integrity, heat dissipation, and installation), improving overall device reliability.
2Reliability
If the lighting device is exposed to external environment, then it is easy to install and maintain, but moisture ingress affects reliability
Solution Approach 1:
A waterproof seal (flexible barrier element) is introduced between the case body and case cover to prevent moisture ingress while maintaining the overall simple and open structure of the device. This thin film barrier provides protection without significantly complicating the installation process.
3Temperature
If heat dissipation features are added to the case body, then thermal management is improved, but manufacturing complexity increases
Solution Approach 1:
The heat dissipation fins are integrated directly into the case body structure rather than being separate components. This merging eliminates the need for additional assembly steps and reduces manufacturing complexity while still providing effective thermal management through increased surface area.
Solution Approach 2:
The case body appears to be made from a material that combines structural integrity with adequate thermal conductivity, allowing it to serve both mechanical and thermal functions. This composite approach enables heat dissipation features to be built into the case body without requiring complex multi-material assembly.
4Reliability
If a protective ring structure is added, then moisture protection is improved, but device complexity increases
Solution Approach 1:
A waterproof seal (flexible barrier element) is introduced between the case body and case cover to prevent moisture ingress while maintaining the overall simple and open structure of the device. This thin film barrier provides protection without significantly complicating the installation process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves thermal dissipation, maintains device reliability by preventing moisture ingress, and facilitates easy maintenance and attachment to various support structures, enhancing the overall performance and longevity of the lighting device.
Implementation Method 1
a heat sink between the light emitting module and the case body to transfer heat from the light emitting module to the case body
Implementation Method 2
the case body acts as a conduit to transfer heat from the lighting emitting module to the portion of the case body including at least one first hole
Data Source
AI summary
A lighting device includes a light emitting module including a substrate and a light emitting device mounted on the substrate; a case body receiving the light emitting module; a gap member contacting the case body and wider than the substrate; a lens on the light emitting module and contacting the gap member; a first ring provided on a peripheral portion of the lens; and a case cover coupled with the case body and having an opening, wherein the case body is provided therein with a coupling cavity in which the gap member is seated, and wherein the lens includes a first portion between the ring and the gap member and a second portion that extends outward from the first portion through the opening of the case cover.


