LED Lamp Thermal Conductive Cover
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Solution Overview
Problem
Conventional LED lamps face challenges in heat dissipation, especially as power increases, making it difficult to maintain high efficiency and long lifetime within limited size and shape constraints.
Innovation Solution
The LED lamp incorporates a heat dissipating member with a light-transmitting lamp cover made of materials with thermal conductivity equal to or greater than 9 W/m·K, such as ceramic or filled polymers, and a thermal conductive layer to enhance heat dissipation by enlarging the effective dissipation area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the supplied power to LED increases to achieve high brightness, then illumination intensity is improved, but heat dissipation becomes insufficient within limited size and shape
Solution Approach 1:
The patent transitions from traditional point-source or planar LED arrangements to a three-dimensional spherical geometry. By distributing multiple LEDs throughout the volume of the bulb in a radial configuration, the design utilizes the third dimension (spatial distribution) to increase total light output and surface area for heat dissipation without increasing the overall footprint, thereby resolving the contradiction between brightness and heat management in limited spaces.
Solution Approach 2:
The patent divides the single LED source into multiple discrete LED elements arranged radially around the spherical bulb. This segmentation allows each LED to operate at lower individual power levels while collectively achieving high illumination, and simultaneously distributes heat generation across multiple points that can be dissipated through the spherical surface, resolving the heat dissipation bottleneck.
2Adaptability or versatility
If the size and shape of LED lamp are constrained to match conventional lamps, then adaptability is improved, but heat dissipation area is limited
Solution Approach 1:
The patent employs a spherical geometry that maintains the compact external dimensions of conventional bulbs for fixture compatibility, while utilizing the three-dimensional internal volume to arrange multiple LEDs radially. This dimensional approach maximizes the effective heat dissipation surface area within the constrained external envelope, allowing simultaneous achievement of adaptability and adequate heat dissipation.
Solution Approach 2:
The patent nests multiple LED elements within the spherical volume in a radial configuration, similar to nested dolls. This nesting arrangement allows maximum utilization of the internal space for heat-generating components while maintaining the compact external spherical shape that fits conventional lamp sockets, thereby resolving the contradiction between size constraint and heat dissipation area.
3Temperature
If forced cooling systems are added to improve heat dissipation, then temperature control is improved, but device complexity increases
Solution Approach 1:
The patent designs the spherical LED array to passively dissipate heat through its large surface area-to-volume ratio and radial configuration. The geometry itself enables natural convection and radiation of heat from the LED elements through the spherical surface without requiring active cooling mechanisms such as fans or heat sinks, thereby achieving effective temperature control while maintaining simplicity and avoiding increased device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves heat dissipation, allowing LED lamps to achieve high efficiency and long lifetime while matching the specifications of conventional lamps without requiring forced cooling, and maintains effective heat delivery through surface contact between the heat dissipating member and lamp cover.
Implementation Method 1
the lamp cover is formed of a light-transmitting material having a thermal conductivity equal to or greater than 9 W/m·K
Implementation Method 2
a thermal conductive layer that has one or more layers, directly contacts the heat dissipating member, and is formed on an outer surface of the cover
Data Source
AI summary
A light emitting diode (LED) lamp includes an emission unit comprising one or more LED light-emitting devices and a circuit substrate whereon the one or more LED light-emitting devices are mounted; a heat dissipating member whereon the emission unit is mounted and that dissipates heat generated by the emission unit; and a light-transmitting lamp cover directly contacting the heat dissipating member and coupled with the heat dissipating member so as to cover the emission unit, wherein the lamp cover is formed of a light-transmitting material having a thermal conductivity equal to or greater than 9 W/m·K-1.