Light-emitting Device Package Alloy Bonding and Resin Extraction
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Solution Overview
Problem
Current semiconductor device packages face challenges in improving light extraction efficiency, electrical characteristics, and manufacturing yield, while also experiencing re-melting phenomena during re-bonding processes, which affect the reliability and cost-effectiveness of the packaging process.
Innovation Solution
The semiconductor device package design includes a first and second frame with conductive layers, a body with a recess, and a light emitting device with bonding parts, where the conductive layers form alloy layers with the frames to enhance bonding strength and prevent re-melting, and a resin is used to improve light extraction and structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding processes are used to connect lead frames to semiconductor devices, then manufacturing simplicity is maintained, but re-melting phenomena occur during re-bonding processes affecting reliability
Solution Approach 1:
The patent applies parameter changes by forming alloy layers with specific compositions (e.g., Sn-Ag-Cu solder alloy) and controlling bonding parameters such as temperature ranges (200-300°C for reflow soldering) and time durations to prevent re-melting while ensuring reliable bonding. The alloy layer composition is carefully selected to have a eutectic point higher than the reflow temperature, preventing re-melting during subsequent bonding processes.
Solution Approach 2:
The patent uses composite material structures by creating multi-layer alloy compositions between lead frames and semiconductor devices. The bonding structure consists of multiple layers including base metal layers (Cu, Ni), intermediate alloy layers (Sn-Ag-Cu), and protective layers, forming a composite material system that provides both strong bonding and resistance to re-melting while maintaining manufacturing feasibility.
2Illumination intensity
If light extraction efficiency is improved through package design modifications, then optical performance increases, but device structure becomes more complex
Solution Approach 1:
The patent introduces an intermediary resin layer between the semiconductor device and the package structure that serves multiple functions: it provides optical coupling to improve light extraction efficiency, acts as a stress buffer to reduce cracking, and maintains structural integrity. This intermediary approach improves optical performance without significantly complicating the overall package structure.
Solution Approach 2:
The package structure employs multi-functional components that simultaneously achieve multiple objectives. For example, the resin encapsulant serves as both a structural support and an optical medium for light extraction enhancement. The lead frame structure provides both electrical connection and mechanical support, reducing the need for additional specialized components and maintaining manufacturing simplicity while improving light extraction.
3Reliability
If electrical characteristics are enhanced through improved bonding, then device performance increases, but manufacturing cost increases due to additional alloy layers
Solution Approach 1:
The patent merges multiple functions into the bonding process itself by forming alloy layers that simultaneously provide electrical connection, mechanical bonding, and protection against re-melting. The Sn-Ag-Cu alloy layer serves as both the bonding agent and the protective barrier, eliminating the need for separate protective coatings and reducing overall manufacturing steps and costs while maintaining enhanced electrical characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances light extraction efficiency, electrical characteristics, and manufacturing yield, while preventing re-melting and improving the reliability and cost-effectiveness of the semiconductor device package by stabilizing the bonding process and structural integrity.
Implementation Method 1
a first alloy layer formed of an alloy of the first conductive layer and the first frame may be disposed between the first conductive layer and the first frame
Data Source
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AI summary
A light emitting device package according to the embodiment includes: a first frame including a first opening part provided through an upper surface and a lower surface of the first frame, and a second frame spaced apart from the first frame and including a second opening part; first and second conductive layers disposed in the first and second opening parts, respectively; a body disposed between the first and second frames; a first resin disposed on the body; and a light emitting device disposed on an adhesive. The light emitting device according to the embodiment includes a first bonding part electrically connected to the first frame and a second bonding part electrically connected to the second frame and spaced apart from the first bonding part, the first and second bonding parts are disposed on the first and second opening parts, respectively, and a first alloy layer formed of an alloy of the first conductive layer and the first frame is disposed between the first conductive layer and the first frame.