LED Array Segmentation and Phosphor Isolation for Uniformity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional light emitting diode (LED) arrays face issues with non-uniformity in color and luminous intensity due to manufacturing variations, requiring costly sorting of LEDs, and the efficiency of phosphor powder is affected by temperature, especially in backlight modules with improper heat dissipation designs.
Innovation Solution
A light emitting diode apparatus utilizing a substrate with a circuit pattern, a reflection layer, and a phosphor layer separated by a sealing material to maintain phosphor efficiency, combined with a reflector and optical microstructure film for enhanced light mixing and directional light control, allowing a broader selection of LED bin codes and improved heat protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If light emitting diodes are sorted by bin codes to ensure uniform color and luminous intensity, then luminous quality is improved, but manufacturing cost increases
Solution Approach 1:
The invention divides the LED array into multiple independent light emitting elements, each with its own reflector and sealing structure. This segmentation allows each element to be optimized independently, enabling the use of LEDs with wider bin code variations while maintaining overall uniformity through individualized optical control.
Solution Approach 2:
The patent applies local quality by providing each light emitting element with a dedicated reflector tailored to its specific characteristics. The reflector's shape, size, and reflective properties are optimized for individual LED performance, allowing compensation for variations in bin codes without requiring strict sorting of all LEDs.
2Manufacturing precision
If phosphor powder is used to convert LED light, then luminous quality is improved, but efficiency declines with increasing environmental temperature
Solution Approach 1:
The invention extracts the phosphor powder from direct contact with the LED chip and heat-generating components by placing it within a sealing material structure. This separation removes the phosphor from the harmful thermal environment while maintaining its light conversion function, thereby preserving efficiency despite high operating temperatures.
Solution Approach 2:
The sealing material acts as an intermediary between the LED chip and phosphor powder, providing thermal isolation while allowing optical interaction. This intermediary structure protects the phosphor from direct heat exposure, maintaining its luminescent efficiency in high-temperature environments.
3Manufacturing precision
If backlight modules use larger projection angle to mix light, then light mixing efficiency is improved, but luminous intensity decreases
Solution Approach 1:
The patent employs asymmetric optical design where the reflector and sealing material structure provide different projection angles in different directions. The structure allows larger projection angles for light mixing in certain directions while maintaining smaller angles in other directions to preserve luminous intensity, creating an optimized asymmetric light distribution pattern.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables better light mixing and stability of phosphor efficiency, reducing costs by allowing a larger selection range of LED bin codes and maintaining luminous quality while addressing temperature-induced efficiency declines.
Implementation Method 1
a phosphor layer disposed on the sealing material and configured to provide uniformly mixed light
Implementation Method 2
a reflector surrounding the light emitting element... a first reflection surface disposed within the interior of the reflector
Data Source
AI summary
A light emitting diode apparatus comprises a substrate having a circuit pattern, a reflection layer disposed on the substrate, at least one light emitting element disposed on the reflection layer, a reflector disposed around the at t one light emitting element, a sealing material formed over the at least one light emitting element and a phosphor layer disposed over the sealing material. The light emitting element comprises a conductive portion electrically coupled to the circuit pattern. In one embodiment, a plurality of light emitting elements are linearly arrayed, and a spacer is disposed between every two adjacent light emitting elements.


