LED Array PCB Layout With Shared Routing to Cut Via Holes

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Solution Overview

Problem

The high defect rate and increased production cost of LED display screens due to the need for numerous holes and additional layers in PCB boards, which complicates the manufacturing process and increases material costs.

Innovation Solution

An LED arrangement structure where LEDs are arranged in a specific array on a PCB board with common-electrode terminals connected to scanning lines in one layer and non-common-electrode terminals connected to data lines in another layer, reducing the number of via holes and eliminating the need for additional board width or layers, thereby lowering production costs and improving yield.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If numerous via holes are used to connect LED terminals to data lines and scanning lines, then electrical connectivity is improved, but the defect rate of PCB board increases and production cost increases

Engineering Contradiction:
Improveelectrical connectivityVSAvoiddefect rate
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent merges the connection paths of multiple LED terminals by routing them through shared via holes. Specifically, multiple data lines or scanning lines are connected to multiple LED terminals through common via holes, reducing the total number of via holes required while maintaining proper electrical connectivity across the LED array.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The via holes are designed to serve multiple functions simultaneously. A single via hole connects not only one LED terminal to its corresponding data or scanning line but also serves as a shared connection point for multiple adjacent LED terminals, making the via hole a multi-functional connection element that reduces overall complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If the width or number of layers of PCB board is increased to accommodate more via holes and routing, then connectivity is improved, but material cost increases greatly

Engineering Contradiction:
ImproveconnectivityVSAvoidmaterial cost
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The patent utilizes the vertical dimension of the PCB board by implementing multi-layer routing architecture. Data lines and scanning lines are arranged on different layers, with via holes providing vertical inter-layer connections. This three-dimensional routing approach allows efficient connectivity without increasing the horizontal board area, thereby avoiding additional material costs.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The routing structure employs a nested arrangement where via holes are strategically positioned to serve multiple routing layers simultaneously. The via hole network is nested within the multi-layer PCB structure, with each via hole potentially connecting multiple layers, thus maximizing the use of existing board material without requiring additional board width or layers.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Ease of manufacture

If the number of via holes is reduced to lower production cost, then material cost decreases, but the complexity of routing and connection increases

Engineering Contradiction:
Improveproduction costVSAvoidrouting complexity
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The LED array is segmented into groups where each group shares common connection via holes. By dividing the LED matrix into logical segments and providing shared via hole connections for each segment, the routing complexity is managed systematically rather than requiring individual unique paths for every LED terminal, thus reducing overall complexity while maintaining connectivity.

Inventive Principle:
Principle #1Segmentation

4Reliability

If via holes are increased to ensure proper connection of all LED terminals, then connection reliability is improved, but the yield of PCB board decreases

Engineering Contradiction:
Improveconnection reliabilityVSAvoidyield
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

Multiple LED terminal connections are merged into shared via holes, ensuring that each via hole provides reliable electrical connection for multiple terminals simultaneously. This merging approach maintains connection reliability while reducing the total via hole count, thereby improving PCB board yield without sacrificing connection quality.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS20240014185A1LED arrangement structures
Publication Date: 2024.01.11 JIANGXI MTC VISUAL DISPLAY CO LTD
  • US20240014185A1 patent drawing
  • US20240014185A1 patent drawing
  • US20240014185A1 patent drawing

AI summary

An LED arrangement structure is provided with a plurality of LEDs arranged in an array in the first direction and the second direction to form a plurality of LED rows and a plurality of LED columns, each of the LED rows includes a plurality of LED groups, and each of the LED groups includes two adjacent LEDs. Two non-common-electrode terminals in each of LED groups in at least one of the LED rows are connected to each other on a surface layer of the PCB board.