LED Array Substrate with Differential Adhesion Patterns

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Solution Overview

Problem

The manufacturing process of LED display panels is limited by the accuracy of transferring and rearranging LED components on temporary storage substrates, resulting in high manufacturing costs due to low arranging density.

Innovation Solution

A light emitting component array substrate is designed with a temporary storage substrate, light emitting components, and alternating first and second adhering patterns. The transmittance and adhesion properties of these patterns differ at specific wavelengths and temperatures, allowing for precise transfer and rearrangement of LED components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If LED components are transferred and rearranged on temporary storage substrates using conventional processes, then the manufacturing process can be completed, but the arranging density is limited by process accuracy resulting in high manufacturing costs

Engineering Contradiction:

Improvearranging densityVSAvoidmanufacturing cost

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent divides the transfer process into multiple stages using different types of temporary storage substrates (first temporary storage substrate and second temporary storage substrate). Each substrate handles specific transfer operations, allowing for optimized arranging density at each stage rather than being limited by a single process step.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces temporary storage substrates as intermediary carriers between the LED component fabrication and final assembly. These substrates provide a platform for rearranging LED components at high density before transfer to the final substrate, effectively decoupling the arranging density requirement from the limitations of direct transfer processes.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If the arranging density of LED components on temporary storage substrates is reduced, then manufacturing cost decreases, but process accuracy limitations prevent further reduction

Engineering Contradiction:

Improvemanufacturing costVSAvoidarranging density

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent utilizes multiple temporary storage substrates arranged in a sequential transfer process, adding a temporal dimension to the arranging process. This allows LED components to be arranged at high density on intermediate substrates and then transferred to the final substrate, effectively bypassing the single-step process accuracy limitations.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Device complexity

If conventional transfer processes are used, then the manufacturing process is simple, but the gap between LED components cannot be reduced resulting in high costs

Engineering Contradiction:

Improveprocess simplicityVSAvoidgap between LED components

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

The patent segments the transfer process into multiple distinct steps using different temporary storage substrates. Each segment handles specific aspects of the transfer and rearrangement, allowing for optimized component spacing and reduced gaps through cumulative precision gains across multiple controlled transfer operations.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution reduces the gap between LED components on the temporary storage substrate, thereby decreasing manufacturing costs while maintaining high efficiency and brightness of the LED display panels.

Implementation Method 1

A transmittance of each of the first adhering patterns at an operating wavelength is different from a transmittance of at least one portion of each of the second adhering patterns at the operating wavelength

Methodology Applied

Scientific EffectLaser heating: Absorption (EM radiation)

Implementation Method 2

an adhesion of each of the first adhering patterns at an operating temperature is different from an adhesion of at least one portion of each of the second adhering patterns at the operating temperature

Methodology Applied

Scientific EffectThermal effect on adhesion: Temperature Gradient

Data Source

PatentUS20250079408A1Light emitting component array substrate

Publication Date: 2025.03.06 AU OPTRONICS CORP

AI summary

A light emitting component array substrate includes a temporary storage substrate, a plurality of light emitting components, a plurality of first adhering patterns and a plurality of second adhering patterns. The light emitting components are disposed on the temporary storage substrate. The first adhering patterns and the second adhering patterns are respectively disposed on the light emitting components. A transmittance of each of the first adhering patterns at an operating wavelength is different from a transmittance of at least one portion of each of the second adhering patterns at the operating wavelength, or an adhesion of each of the first adhering patterns at an operating temperature is different from an adhesion of at least one portion of each of the second adhering patterns at the operating temperature.