LED Array Substrate Support Structure for Uniform Adhesive Transfer
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Solution Overview
Problem
The manufacturing process of light-emitting diode display panels involves multiple transfers of light-emitting diode elements, leading to accumulated offset and decreased bonding yield, along with issues like bonding mura and abnormal debonding due to non-uniform film thickness of the adhesive layer.
Innovation Solution
A light-emitting element array substrate with an adhesive layer and support members to ensure uniform film thickness, using a pressure head with support members to transfer elements onto a temporary substrate, reducing offset and improving bonding yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If multiple transfers of light-emitting diode elements are performed to connect to the driving backplane, then the light-emitting diode elements can be connected to the driving backplane, but the overall offset accumulates and bonding yield decreases
Solution Approach 1:
A temporary substrate with an adhesive layer is introduced as an intermediary carrier. The light-emitting diode elements are first transferred to this temporary substrate, which then serves as a stable intermediate platform for subsequent transfer to the driving backplane. This intermediary approach reduces cumulative offset by providing a reference frame for alignment during multiple transfer operations.
2Productivity
If multiple transfers are performed using a temporary substrate, then light-emitting diode elements can be stored and transferred, but bonding mura occurs due to non-uniform adhesive layer thickness
Solution Approach 1:
The patent modifies the pressure application parameters during adhesive layer formation. By controlling the pressure head to apply uniform pressure and adjusting pressing force and duration, the adhesive layer achieves consistent thickness across the entire substrate surface. This parameter optimization ensures uniform bonding properties while maintaining high transfer efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances film thickness uniformity to ~3.3% and reduces overall offset, improving bonding yield and transposition speed while minimizing bonding mura.
Implementation Method 1
using a pressure head to press down the second surface of the temporary base of the light-emitting elements supply substrate, so that the light-emitting elements are connected to the adhesive layer of the temporary substrate
Data Source
AI summary
A light-emitting element array substrate includes a temporary base, an adhesive layer, light-emitting elements and at least one support member. The temporary storage base has a first surface and a second surface opposite to each other. The adhesive layer is disposed on the first surface of the temporary storage base. The light-emitting elements are disposed on the adhesive layer. The adhesive layer is located between the light-emitting elements and the temporary storage substrate. The at least one support member is disposed on at least one of the first surface and the second surface of the temporary storage base. In addition, a method for manufacturing a light-emitting element array substrate is also provided.