LED Assembly Thermal Management for Color Stability
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Solution Overview
Problem
Light emitting diode assemblies using red light emitting diodes face issues with spectrum shift due to increased junction temperature, leading to changes in color coordinates over time and thermal interference with other diodes, resulting in poor color rendering index and high color temperature.
Innovation Solution
A light emitting diode assembly is designed with a red light emitting diode chip and a short wavelength light emitting diode chip, where a second heat dissipator with higher heat dissipation capability is used to rapidly dissipate heat from the red light emitting diode chip, preventing spectrum shift and reducing thermal interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a red light emitting diode chip is used to improve color rendering index and color temperature, then the color quality is improved, but the junction temperature increases causing spectrum shift and color coordinate changes
Solution Approach 1:
The heat dissipation system is segmented into two independent pathways: a first heat dissipator for the short wavelength LED and a second heat dissipator for the red LED. This segmentation allows each LED to be cooled independently, preventing the red LED's junction temperature from rising and causing spectrum shift, while maintaining the improved color rendering index provided by the red LED
Solution Approach 2:
The second heat dissipator is designed with higher heat dissipation capability specifically for the red LED region, with its heat dissipation capacity being greater than that of the first heat dissipator. This localized enhancement ensures that the red LED, which generates more heat and is more sensitive to temperature, receives preferential cooling to prevent spectrum shift
2Reliability
If a red light emitting diode chip is used to improve color rendering index, then the color quality is improved, but thermal interference with other light emitting diode chips occurs
Solution Approach 1:
The heat dissipation system is divided into separate pathways with the first heat dissipator for the short wavelength LED and the second heat dissipator for the red LED. This segmentation prevents heat generated by the red LED from transferring to the short wavelength LED, eliminating thermal interference while maintaining the color rendering benefits of the red LED
Solution Approach 2:
The separate heat dissipators act as thermal intermediaries that isolate the red LED from the short wavelength LED. By providing dedicated thermal management pathways, the system prevents harmful thermal coupling between different LED types, allowing the red LED to contribute to color rendering without causing thermal interference
3Stability of the object's composition
If heat dissipation capability is increased for the red light emitting diode chip, then spectrum shift is prevented, but device complexity increases
Solution Approach 1:
The patent merges the heat dissipation functions into a unified package structure where both the first and second heat dissipators are integrated into the same housing or substrate. This combining approach provides enhanced cooling for the red LED through the second heat dissipator while avoiding the complexity of completely separate cooling systems, maintaining spectrum stability with moderate structural complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents spectrum shift and color coordinate changes over time, improving the operational stability and color rendering index of the light emitting diode assembly by efficiently managing heat dissipation and reducing thermal interference.
Implementation Method 1
a second heat dissipator dissipating heat generated from the red light emitting diode chip
Implementation Method 2
the red light emitting diode chip is thermally coupled to the second landing pad
Implementation Method 3
a red light emitting diode chip
Implementation Method 4
red light emitting diodes emit relatively large amounts of heat
Implementation Method 5
a short wavelength light emitting diode chip emitting light having a shorter wavelength than light emitted from the red light emitting diode chip
Data Source
AI summary
Disclosed is a light emitting diode assembly. The light emitting diode assembly comprised: a red light emitting diode chip; a short-wavelength light emitting diode chip emitting a light having a wavelength relatively shorter than that of a light emitted from the red light emitting diode chip; a first heat-dispersion member for dispersing most of the heat generated in the short wavelength light emitting diode chip; and a second heat-dispersion member for dispersing most of the heat generated in the red light emitting diode chip. Further, the second heat-dispersion member has heat dispersion performance relatively superior to that of the first heat dispersion member. Thus, spectrum movement in the red light emitted from the red light emitting diode chip may be prevented so as to prevent a color-coordinate transformation during the operation time of same.