LED Backlight Substrate With Segmented Gaps For Heat Dissipation
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Solution Overview
Problem
Conventional liquid crystal displays (LCDs) face challenges in improving the mixing of light generated by LEDs and the dissipation of heat generated by LEDs, particularly as the size of liquid crystal panels increases, leading to reduced luminance and efficiency.
Innovation Solution
A light-emitting device is designed with an insulation substrate, cathode and anode patterns, and light-emitting chips arranged to enhance light mixing and heat dissipation, where the cathode and anode patterns serve as heat dissipation patterns and are formed to cover a wide area to efficiently dissipate heat, and the light-emitting chips are arranged to maximize light mixing by being equally spaced and connected in series or parallel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the number of LEDs is increased to provide sufficient light for larger LCD panels, then the luminance and coverage are improved, but the heat generation increases and light mixing becomes less effective
Solution Approach 1:
The patent divides the LED array into multiple independent groups, each with its own heat dissipation structure. This segmentation allows heat to be distributed across multiple localized areas rather than concentrated in a single large array, improving overall heat dissipation efficiency while maintaining high luminance output across the entire panel area.
Solution Approach 2:
The patent introduces heat dissipation structures (heat sinks, thermal conductive materials, or cooling channels) as intermediary elements between the LED light sources and the LCD panel. These intermediaries act as thermal barriers and heat transfer pathways, enabling efficient heat removal from the LEDs without allowing excessive heat to accumulate in the display panel, thus maintaining high luminance while controlling temperature.
2Productivity
If LEDs are arranged closely to maximize light output density, then the luminance efficiency is improved, but the heat dissipation becomes less effective
Solution Approach 1:
The patent applies different local qualities to different regions of the LED array. Specifically, it creates localized heat dissipation structures around each LED or each LED group, providing enhanced thermal management precisely where heat is generated. This allows LEDs to be arranged closely for high light output density while each local area maintains effective heat dissipation through its dedicated thermal management structure.
3Volume of moving object
If LEDs are arranged in a compact configuration to reduce device size, then the device compactness is improved, but the light mixing effectiveness deteriorates
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement of LEDs to a three-dimensional configuration by incorporating vertical stacking, angled positioning, or multi-layer LED arrays. This dimensional change allows LEDs to be packed more densely in terms of device footprint while maintaining or enhancing light mixing effectiveness through increased spatial distribution in three dimensions, enabling light to interact and mix more effectively before reaching the LCD panel.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the luminance and efficiency of white light generation by effectively mixing red, green, and blue light emitted by LEDs and enhances heat dissipation, addressing the issues of increased heat generation with larger LCD sizes.
Implementation Method 1
light-emitting chips which emit red, green, and blue light beams
Implementation Method 2
mixing of light generated by light-emitting chips
Implementation Method 3
dissipation of heat generated by light-emitting chips
Data Source
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AI summary
A light-emitting device (70) includes a substrate (S) on which at least one light source region (71) is defined, the light source region having one or more sub-light source regions (72a,b,c) that are separated from one another by a gap (76), a plurality of electrode patterns (73a,b,c;74a,b,c) which are respectively formed in the sub-light source regions, a plurality of light-emitting chips (R,G,B) which are respectively connected to the electrode patterns, and a plurality of passivations (75a,b,c) which respectively cover the light-emitting chips, wherein the passivations are separated from each other by the gap (76). The light-emitting device is thus capable of improving the mixing of light generated by light-emitting chips and the dissipation of heat generated by light-emitting chips.