LED Display Bonding Layout for Strong Adhesion and Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing LED display devices face challenges in manufacturing efficiency and electrical connection due to insufficient adhesion between light-emitting units and substrates, leading to poor electrical connections and increased costs.
Innovation Solution
A method for forming LED display devices involves a substrate with a light-emitting unit having conductive layers on both sides, allowing for flexible connection with the substrate, and an adhesion layer formed using a lithography process to ensure proper bonding and alignment of light-emitting units, optimizing the spacing between units and adhesion layers to enhance adhesion force.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional bonding methods are used for LED display devices, then manufacturing costs are reduced, but adhesion force between light-emitting units and substrate is insufficient
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesion layer by incorporating silane coupling agents (such as γ-glycidoxypropyltrimethoxysilane or γ-methacryloxypropyltrimethoxysilane) into the adhesion layer formulation. This chemical parameter modification enables the adhesion layer to form strong chemical bonds with both the substrate and light-emitting units, achieving adhesion force of at least 300 gf while maintaining cost-effectiveness through a single-layer structure.
2Strength
If adhesion layer thickness is increased to improve bonding, then adhesion force is enhanced, but manufacturing precision and alignment are compromised
Solution Approach 1:
The patent optimizes the thickness parameter of the adhesion layer to a specific range of 50-200 nm. This parameter optimization achieves a balance where the layer is thick enough to provide sufficient adhesion force (at least 300 gf) through enhanced chemical bonding, yet thin enough to maintain manufacturing precision and alignment accuracy during the bonding process.
3Reliability
If complex multi-layer adhesion structures are used, then bonding reliability is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges multiple functions into a single adhesion layer by incorporating silane coupling agents that provide both adhesion promotion and chemical bonding capabilities. This single-layer structure integrates the functions of multiple traditional layers (primer layer, adhesion layer, and protective layer), achieving bonding reliability with at least 300 gf adhesion force while significantly reducing structural complexity and manufacturing difficulty.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the manufacturing process flexibility and electrical connection quality, reducing costs and enhancing the light-emitting efficiency by ensuring robust adhesion and efficient electrical pathways.
Implementation Method 1
forming an adhesion layer on the substrate to cover the plurality of bonding pads
Implementation Method 2
patterning the adhesion layer by a lithography process to form a patterned adhesion layer to correspond to the plurality of bonding pads
Implementation Method 3
bonding a light-emitting unit to at least one of the bonding pads through the patterned adhesion layer
Data Source
Figure 1A
Figure 1B
Figure 1C
AI summary
A display device is provided. The display device includes a substrate, and a light-emitting unit disposed on the substrate. The light-emitting unit includes a first conductive layer overlapping a second conductive layer, a first semiconductor layer disposed between the first conductive layer and the second conductive layer, a second semiconductor layer disposed between the first semiconductor layer and the first conductive layer, a quantum well structure disposed between the first semiconductor layer and the second semiconductor layer, and a via hole penetrated through the first semiconductor layer and the quantum well structure. The second conductive layer is electrically connected with the second semiconductor layer through a conductive material disposed in the via hole.