LED Die Bonding Resin with Au-Triggered Partial Curing
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Solution Overview
Problem
Current methods for manufacturing light-emitting devices lack high bonding reliability between the light-emitting element and the wiring substrate, which can lead to peeling issues during thermal expansion.
Innovation Solution
A method involving a resin composition with specific siloxane compounds and a hydrosilylation reaction catalyst is used, where the composition is oxidized in contact with Au-containing components to form a cured resin member, while the non-contact portion remains in a liquid state, enhancing bonding strength and reducing thermal expansion-induced peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a resin composition is used to bond the light-emitting element to the wiring substrate, then bonding strength is improved, but thermal expansion differences cause peeling and reduce reliability
Solution Approach 1:
The patent changes the physical state parameter of the resin composition by maintaining a liquid state portion alongside a cured portion. The liquid state resin (unreacted component B with SiH groups) provides flexibility to accommodate thermal expansion differences between the light-emitting element and wiring substrate, preventing peeling while maintaining strong bonding. This parameter change from fully cured to partially liquid state resolves the contradiction between bonding strength and thermal expansion compatibility.
2Stability of the object's composition
If the resin composition is fully cured, then structural integrity is improved, but it cannot accommodate thermal expansion leading to peeling
Solution Approach 1:
The patent applies local quality by creating different regions within the resin composition with different properties. The first portion (cured state) provides structural integrity and stability, while the second portion (liquid state) provides flexibility for thermal expansion accommodation. This spatial differentiation of properties within the same resin composition allows both structural integrity and thermal expansion compatibility to coexist, resolving the contradiction between these two requirements.
3Reliability
If component B is oxidized in contact with Au, then a liquid state portion is formed to accommodate thermal expansion, but the oxidation process complexity increases
Solution Approach 1:
The patent applies self-service by utilizing the Au component (element electrodes, wiring layers, or conductive members) to catalyze the oxidation of component B automatically. The Au material serves its dual function of electrical conduction and oxidation catalysis, eliminating the need for external catalysts or additional processing steps. This self-catalyzing oxidation process simplifies manufacturing while achieving the desired liquid state portion for improved bonding reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves high bonding reliability between the light-emitting element and the wiring substrate, reducing peeling and maintaining the resin member in a liquid state to accommodate thermal expansion without pushing the light-emitting element away from the substrate.
Implementation Method 1
oxidizing the component B in the resin composition in contact with the at least one member containing Au of the element electrodes, the wiring layers, or the conductive members to form a first portion of a resin member
Implementation Method 2
heating and curing the resin composition not in contact with the at least one member containing Au of the element electrodes, the wiring layers, or the conductive members to form a second portion of the resin member
Data Source
AI summary
A method for manufacturing a light-emitting device includes providing a light-emitting element having element electrodes including a positive element electrode and a negative element electrode, a wiring substrate having wiring layers, and conductive members each electrically connecting one of the element electrodes and a corresponding one of the wiring layers, with at least one member of the element electrodes, the wiring layers, or the conductive members containing Au; arranging, between a lower surface of the light-emitting element and the wiring substrate, a resin composition in a liquid state; oxidizing a component B in the resin composition in contact with the at least one member containing Au; and after the oxidizing of the component B, heating and curing the resin composition not in contact with the at least one member containing Au.