LED Bracket Layer Layout for Larger Chip Area and Isolation
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Solution Overview
Problem
Current LED device brackets have limited placement areas for LED chips due to a large insulation trench, resulting in low luminance and incompatibility with larger light-emitting chips, while also risking short-circuiting when connected externally.
Innovation Solution
The bracket design includes a first photo-etched metal part with a chip placement layer of greater area than the electrode, a second photo-etched metal part with a connection layer, and reduced insulation trenches, allowing for increased placement area and compatibility with existing electrodes while preventing short-circuiting through identical trench width and area configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the insulation trench width is increased to prevent short-circuiting, then the reliability of the LED device is improved, but the area available for placing LED chips is reduced, resulting in lower luminance
Solution Approach 1:
The patent introduces a vertical stacking dimension by placing the chip placement layer above the first electrode in the Z-direction. This allows the insulation trench to be positioned between the chip placement layer and connection layer rather than between the first and second electrodes, enabling horizontal expansion of the chip placement area without compromising electrical insulation reliability.
Solution Approach 2:
The bracket is segmented into multiple functional layers: first electrode, chip placement layer, second electrode, and connection layer. The insulation trenches are strategically positioned between specific layers (first insulation trench between first electrode and second electrode, second insulation trench between chip placement layer and connection layer), allowing optimized space allocation for both electrical isolation and chip placement.
2Illumination intensity
If the chip placement area is increased to accommodate larger LED chips, then the luminance is improved, but the risk of short-circuiting increases
Solution Approach 1:
By utilizing the vertical stacking arrangement where the chip placement layer is positioned above the first electrode, the design expands the chip placement area horizontally without encroaching on the electrical insulation space, which is maintained through vertically positioned insulation trenches between layers.
Solution Approach 2:
The insulation trenches act as intermediary elements positioned between functional layers rather than within the chip placement area. The first insulation trench between the first electrode and second electrode, and the second insulation trench between the chip placement layer and connection layer, provide electrical isolation without interfering with chip placement.
3Illumination intensity
If the bracket design is modified to accommodate larger chips, then the luminance is improved, but the compatibility with existing electrodes is reduced
Solution Approach 1:
The bracket is divided into distinct functional segments: first electrode for electrical connection, chip placement layer for mounting LED chips, second electrode for electrical connection, and connection layer for external wiring. This segmentation allows the first electrode to maintain existing dimensions for compatibility while the chip placement layer extends beyond it to accommodate larger chips.
Solution Approach 2:
The chip placement layer extends in the horizontal direction beyond the boundaries of the first electrode, utilizing the vertical stacking arrangement to achieve lateral expansion without modifying the electrode footprint, thereby maintaining compatibility with existing electrode designs.
Data Source
AI summary
An LED device and a bracket thereof. The bracket includes a first photo-etched metal part, composed of a first electrode and a chip placement layer stacked thereon, wherein an area of the chip placement layer is greater than an area of the first electrode; a second photo-etched metal part, composed of a second electrode and a connection layer stacked thereon; wherein a first insulation trench is provided between the first electrode and the second electrode, and a second insulation trench is provided between the chip placement layer and the connection layer. The LED device and the bracket thereof can increase the placement area for placing LED chips, thereby improving the luminance of the LED device.