LED Buffer Structure Absorbs Laser Lift Off Energy
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Solution Overview
Problem
Conventional light emitting diodes (LEDs) are prone to damage, such as cracking, during the manufacturing process, particularly due to the impact of laser energy in the Laser Lift Off (LLO) process, which affects their reliability and light emission efficiency.
Innovation Solution
Incorporating a buffer structure with a zener device spaced apart from the light emitting structure, which absorbs the impact of laser energy and prevents damage, while also improving light emission efficiency through a reflective layer and adhesive layers, and enhancing manufacturing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the Laser Lift Off process is used to manufacture LEDs, then productivity is improved, but the light emitting structure is damaged by laser energy impact
Solution Approach 1:
A buffer structure is introduced as an intermediary element positioned between the light emitting structure and the substrate. This buffer structure absorbs the impact of laser energy during the LLO process, preventing direct damage to the light emitting structure while enabling the manufacturing process to proceed effectively
2Device complexity
If the light emitting structure is placed close to the substrate for compact design, then device complexity is reduced, but the structure is vulnerable to laser damage
Solution Approach 1:
The buffer structure serves as a protective intermediary that can be integrated into the existing compact design. It is positioned at a specific distance from the light emitting structure, creating a protective zone that absorbs laser energy while maintaining the overall compactness of the device
3Ease of manufacture
If no buffer structure is used to maintain simple manufacturing, then ease of manufacture is improved, but cracks occur in the light emitting structure
Solution Approach 1:
The buffer structure is prepared in advance and positioned at a predetermined location before the LLO process begins. This preliminary preparation ensures that the protective element is in place to absorb laser energy, preventing cracks in the light emitting structure during manufacturing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The buffer structure effectively prevents cracks in the light emitting structure, enhances the reliability of the LED, and improves light emission efficiency by absorbing laser energy and maintaining the structural integrity during the manufacturing process.
Implementation Method 1
Incorporating a buffer structure with a zener device spaced apart from the light emitting structure, which absorbs the impact of laser energy and prevents damage
Data Source
AI summary
Disclosed are a method of fabricating a light emitting device includes the steps of: forming a plurality of compound semiconductor layers on a substrate, the substrate including a plurality of chip regions and isolation region; selectively etching the compound semiconductor layers to form a light emitting structure on each chip region and form a buffer structure on the isolation region; forming a conductive support member on the light emitting structure and the buffer structure; removing the substrate by using a laser lift off process; and dividing the conductive support member into the a plurality of chips of the chip regions, wherein the buffer structure is spaced apart from the light emitting structure.