LED Carrier Cavity Structure for Shear-Stable Chip Packaging
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Solution Overview
Problem
Radiation-emitting components, such as light-emitting diodes, face mechanical instability due to shear forces, leading to dislocations and heat accumulation, which affects both mechanical and thermal stability.
Innovation Solution
A radiation-emitting component design featuring a carrier with a cavity and a semiconductor chip arranged within, where the chip and reflector layers are enclosed by the carrier's side walls, absorbing shear forces and preventing dislocation, while a conversion layer enhances light extraction by converting primary radiation into secondary radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the radiation-emitting component uses a conventional structure without a carrier cavity, then the manufacturing process is simpler, but the component suffers from mechanical instability due to shear forces causing dislocations
Solution Approach 1:
The carrier is divided into a bottom part and a side wall part that are inserted into cavities of each other, creating a modular structure. This segmentation allows the side wall to absorb shear forces independently while maintaining overall structural integrity, resolving the contradiction between mechanical stability and structural simplicity.
Solution Approach 2:
The bottom part and side wall part of the carrier are inserted into cavities of each other in a nested configuration. This nesting creates interlocking joints that effectively transfer and distribute shear forces, preventing dislocations while maintaining a relatively simple overall structure.
2Reliability
If the carrier side walls are made thick to absorb shear forces, then mechanical stability improves, but the cavity volume for arranging components decreases
Solution Approach 1:
The side wall is segmented into a main body portion and an inserted portion that fits into the bottom part's cavity. This segmentation allows the side wall to provide mechanical strength through its inserted portion while keeping the main body portion thin, thereby maintaining both mechanical stability and sufficient cavity volume.
Solution Approach 2:
The carrier structure utilizes vertical insertion into cavities rather than relying solely on horizontal wall thickness. By transferring shear forces through vertical insertion joints, the design achieves mechanical stability without increasing the horizontal dimensions, thus preserving cavity volume.
3Reliability
If the carrier structure is made complex with multiple insertion joints, then shear force absorption improves, but the manufacturing precision requirements increase
Solution Approach 1:
The carrier is segmented into standardized bottom and side wall parts with matching cavities. This segmentation creates repeatable insertion joints that can be manufactured with consistent tolerances, reducing the overall manufacturing precision requirements compared to a monolithic complex structure.
Solution Approach 2:
The insertion joint design serves multiple functions: mechanical connection, shear force absorption, and alignment. This multi-functionality reduces the need for additional separate features, simplifying the overall manufacturing precision requirements despite the complex load-bearing requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly enhances mechanical stability by absorbing shear forces and improves thermal stability by reducing heat accumulation, while efficiently producing radiation-emitting components through simplified manufacturing processes.
Implementation Method 1
a conversion layer (5) arranged above a top surface of the radiation-emitting semiconductor chip (3) and configured to convert a part of the primary radiation into secondary radiation
Data Source
AI summary
A radiation-emitting component (1) is specified witha carrier (2) having a cavity (9),a radiation-emitting semiconductor chip (3) which is arranged on a bottom surface delimiting the cavity (9) and which is configured to generate primary electromagnetic radiation, anda first reflector layer (6) arranged above a top surface of the semiconductor chip (3), whereinthe carrier (2) is transparent in places to the primary electromagnetic radiation, andthe semiconductor chip (3) is spaced apart from at least one side surface delimiting the cavity (9).