LED Chip Assembly with Embedded Conductive Layers
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Solution Overview
Problem
The line width and spacing of preset lines on circuit boards in existing LED technologies cannot meet the connection requirements for LED chips, leading to poor connection effects and contact issues, especially for smaller LED chips.
Innovation Solution
An LED chip assembly is designed with a substrate layer, an LED light-emitting unit, a transparent support layer, and insulating layers, where the LED chip's electrodes are exposed and connected through conductive parts and circuits within the insulating layers, eliminating the need for a circuit board with preset lines, thus facilitating precise connection and packaging of smaller LED chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a preset line is used on a circuit board to connect the LED chip, then the connection process is simplified, but the line width and line spacing cannot meet the connection requirements for small-sized LED chips (less than 20 μm)
Solution Approach 1:
The patent divides the connection structure into multiple independent layers: substrate layer, first insulating layer with circuits, and second insulating layer with conductive parts. This segmentation allows each layer to be optimized independently, enabling precise connection for small LED chips while maintaining manufacturing simplicity.
Solution Approach 2:
The patent transitions from a planar preset line structure to a multi-layer three-dimensional structure. By stacking insulating layers and conductive parts in different dimensions, the design achieves both fine pitch compatibility (for small LED chips) and manufacturing ease without being constrained by single-plane line width limitations.
2Manufacturing precision
If a higher-precision substrate is used to meet the connection requirements of small LED chips, then the connection precision is improved, but the cost increases significantly
Solution Approach 1:
The substrate system is segmented into a base substrate layer and additional functional layers (insulating layers with integrated circuits and conductive parts). This allows using a standard, cost-effective substrate while achieving high precision connections through the layered structure, avoiding the need for expensive high-precision substrates.
Solution Approach 2:
The first and second insulating layers act as intermediary structures between the substrate and the LED chip. These intermediary layers provide the necessary precision and circuit integration without requiring the substrate itself to be high-precision, thereby reducing overall manufacturing cost while maintaining connection quality.
3Area of moving object
If the LED chip size is reduced to increase pixel density, then the display resolution is improved, but the connection reliability deteriorates due to insufficient line width and spacing
Solution Approach 1:
By moving from a two-dimensional planar connection to a three-dimensional multi-layer structure, the patent enables reliable connections for small LED chips. The vertical stacking of conductive parts and insulating layers provides multiple connection paths and sufficient spacing, maintaining connection reliability even as chip size decreases for higher pixel density.
Solution Approach 2:
The patent implements a nested structure where conductive parts and circuits are embedded within insulating layers, which are in turn positioned on the substrate. This nested arrangement allows precise positioning and reliable electrical connections for small LED chips while maintaining adequate spacing and connection integrity.
Data Source
AI summary
The disclosure provides an LED chip assembly, an LED display apparatus and a processing method of the LED chip assembly. Herein, the LED chip assembly includes: a substrate layer; an LED light-emitting unit arranged in the substrate layer, the LED light-emitting unit including an LED chip; a transparent support layer arranged on a front side of the substrate layer and covering a light-emitting surface of the LED chip; a first insulating layer arranged on a back side of the substrate layer, a first circuit connected with a first electrode of the LED chip and a second circuit connected with a second electrode of the LED chip being arranged in the first insulating layer; and a second insulating layer arranged on a back side of the first insulating layer, a first conductive part in conductive connection with the first circuit and a second conductive part in conductive connection with the second circuit being arranged in the second insulating layer, and the first conductive part and the second conductive part being exposed from a back surface of the second insulating layer. A technical solution of the application effectively solves a problem that a line width and a line spacing of a preset line on a circuit board in a related art cannot meet connection requirements with an LED chip.