LED Light Plate Chip Transfer Using Electrostatic Functional Layers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in display technology is efficiently and accurately transferring tens of thousands of LED chips to a target substrate without damaging them during the mass transfer process in Mini-LED and Micro-LED display devices.
Innovation Solution
A method involving the disposition of functional layers with charged particles on LED chips, which are then absorbed by a transport substrate and transferred to the target substrate using electrodes, improving production efficiency and preventing charge particle contact that could affect light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If LED chips are transferred one by one to the target substrate, then the placement precision can be maintained, but the production efficiency is low
Solution Approach 1:
Multiple LED chips are merged onto a single transport substrate, allowing simultaneous transfer of multiple chips to the target substrate in one operation, thereby improving production efficiency and reducing total transfer time
Solution Approach 2:
A transport substrate is introduced as an intermediary carrier to hold multiple LED chips during transfer. This mediator enables batch transfer operations while maintaining precise placement through the substrate's groove structure that guides chip positions
2Productivity
If charged particles are applied directly to LED chips for transfer, then the transfer efficiency is improved, but the charged particles may remain on the chip surface and affect light emission
Solution Approach 1:
The charged particles are extracted from the final product by removing the functional layer after transfer. The functional layer serves as a temporary carrier for charged particles during transfer, and its removal eliminates the particles that would otherwise contaminate the LED chip surface and affect light emission
Solution Approach 2:
The functional layer acts as an intermediary that temporarily holds the charged particles during the transfer process. This mediator allows efficient electrostatic transfer while isolating the LED chip from direct contact with charged particles, preventing surface contamination
3Productivity
If multiple LED chips are transferred simultaneously, then production efficiency is improved, but the risk of chip damage during transfer increases
Solution Approach 1:
The transport substrate provides a protective platform for multiple LED chips before transfer. The groove structure and suspension medium create a cushioning environment that prevents chip-to-chip contact and damage during handling and transfer operations
Solution Approach 2:
A suspension medium is used to buoy and support the LED chips during transfer operations. This hydraulic approach allows gentle handling of multiple chips simultaneously, reducing mechanical stress and damage risk while maintaining transfer efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances production efficiency by directly absorbing and transferring multiple LED chips, preventing charge particle residue from impacting light emission and ensuring accurate placement, thus improving the functionality of the LED light plate.
Implementation Method 1
energizing the first electrode and the second electrode, absorbing the chip to be transferred by the transport substrate, and causing the functional layer to move into the groove
Data Source
AI summary
A method of fabricating an LED light plate, an LED light plate, and a display device are disclosed. The method includes: disposing a functional layer on each LED chip to form multiple chips to be transferred; placing the chips into a receiving tank filled with a suspension; defining a plurality of grooves matching the shape of the functional layer in the transport substrate; placing the transport substrate into the suspension so that a first electrode in each receiving tank faces each second electrode in the respective groove and that each chip is located between the first electrode and the respective second electrode; energizing the first electrode and each second electrode, so that each chip is absorbed by the transporting substrate, and each functional layer is moved into the respective groove; and transplanting the multiple chips onto a target substrate; where each functional layer is filled with multiple charged particles.