Integrated Lead Frame Coupling for LED Chip Packaging
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Solution Overview
Problem
The multistep packaging process for chip-based electronic devices, such as LED chips, increases manufacturing costs and complexity, necessitating a simplification of the packaging process to reduce material costs and enhance efficiency.
Innovation Solution
The design of improved lead frames for chip packages with specific coupling portions, connection structures, and reflective cavities that allow for direct electrical connection and light reflection, enabling the chips to be mounted and connected in series or parallel configurations, thereby simplifying the packaging process and enhancing light emission efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a multistep packaging process is used for chip-based electronic devices, then the chips can be protected and electronically arranged, but the manufacturing costs and process complexity increase
Solution Approach 1:
The patent combines multiple packaging operations into a single integrated lead frame structure. The lead frame simultaneously provides chip mounting substrates, electrical connection paths, and protective encapsulation, eliminating the need for separate primary and secondary packaging processes while maintaining chip protection and electrical functionality
Solution Approach 2:
The lead frame is designed as a multi-functional component that performs multiple roles: it serves as a mounting substrate for chips, provides electrical connection pathways through integrated connection portions, offers mechanical support, and enables both series and parallel configurations. This universal structure replaces multiple specialized packaging components and processes
2Reliability
If a multistep packaging process is used for chip-based electronic devices, then the chips can be protected and electronically arranged, but the manufacturing costs increase
Solution Approach 1:
The patent combines multiple packaging operations into a single integrated lead frame structure. The lead frame simultaneously provides chip mounting substrates, electrical connection paths, and protective encapsulation, eliminating the need for separate primary and secondary packaging processes while maintaining chip protection and electrical functionality
Solution Approach 2:
The invention eliminates unnecessary intermediate packaging steps and materials by directly mounting chips on the lead frame and forming electrical connections in a single process, discarding the need for separate primary packaging substrates and secondary mounting procedures, thereby reducing material costs and manufacturing complexity
3Use of energy by moving object
If reflective cavities are added to improve light extraction, then the illumination efficiency increases, but the package structure becomes more complex
Solution Approach 1:
The reflective cavity is integrated into the lead frame structure, combining the light reflection function with the existing electrical connection and mechanical support structure. This eliminates the need for separate reflective components while improving light extraction efficiency, thereby enhancing illumination performance without significantly increasing structural complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs and complexity by allowing direct assembly of chip packages, improving light extraction efficiency through reflective cavities, and enabling flexible electrical connections, thus making LED-based illumination apparatuses more cost-effective and efficient.
Implementation Method 1
a reflective cavity for reflecting light emitted from the light-emitting device chip
Data Source
Figure 1~2
Figure 3~4
Figure 5A~5B
AI summary
A chip package, a package module, and an illumination apparatus including the chip package module. The chip package includes a first coupling portion and a second coupling portion that are coupled to each other on edges of a lead frame for mounting a chip thereon, and thus a package module is easily embodied by coupling the first coupling portion and the second coupling portion to each other.