LED Circuit Board with Insulation Layer for Thermal Management

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Solution Overview

Problem

Conventional LED circuit boards face challenges in heat dissipation and component arrangement, leading to reduced efficiency and shortened service life due to thermal energy buildup from integrated electronic components.

Innovation Solution

A novel LED circuit board design featuring two circuit boards separated by a fire-retardant and fire-resistant plastic insulation board, with connecting columns and holes for assembly, and accommodating spaces for heat dissipation, enhancing thermal management and component loading capacity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If electronic components are integrated on a conventional PCB, then wiring and assembling errors are reduced and productivity is enhanced, but thermal energy buildup occurs affecting efficiency and service life

Engineering Contradiction:
Improveassembly automationVSAvoidthermal energy buildup
Core Design Contradiction:
ProductivityVSTemperature

Solution Approach 1:

The circuit board is divided into multiple independent circuit boards (first circuit board, second circuit board) that are separated by an insulation board. This segmentation allows each circuit board to have its own accommodating space for heat dissipation, preventing thermal energy buildup while maintaining the benefits of integrated circuitry and automated assembly.

Inventive Principle:
Principle #1Segmentation

2Adaptability or versatility

If chips of higher integration level are used, then more functions are achieved in smaller size, but energy consumption increases requiring better heat dissipation

Engineering Contradiction:
Improvefunction integrationVSAvoidenergy consumption
Core Design Contradiction:
Adaptability or versatilityVSUse of energy by moving object

Solution Approach 1:

The patent transitions from a single-plane circuit board to a multi-layer three-dimensional structure with circuit boards stacked vertically and separated by an insulation board. This dimensional change creates additional accommodating spaces that facilitate heat dissipation from high-power integrated chips, enabling higher function integration without excessive energy buildup.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Temperature

If a multi-layer structure with insulation board is used, then heat dissipation is improved, but device complexity increases

Engineering Contradiction:
Improveheat dissipationVSAvoidstructure complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The insulation board serves multiple functions simultaneously: it provides thermal insulation between circuit boards, acts as a structural support element, creates accommodating spaces for heat dissipation, and features connecting holes for mechanical assembly. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity while achieving improved heat dissipation.

Inventive Principle:
Principle #6Universality (Multi-functionality)

4Ease of manufacture

If connecting columns and holes are used for assembly, then detachable assembly is enabled, but manufacturing precision requirements increase

Engineering Contradiction:
Improvedetachable assemblyVSAvoidfitting precision
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The connecting columns and connecting holes act as intermediary mechanical features that bridge multiple circuit boards and the insulation board. These standardized interface elements enable detachable assembly while distributing the precision requirements across multiple standardized features rather than requiring high precision across the entire assembly, making the system more manufacturable.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively prevents heat conduction between circuit boards, facilitates quick heat dissipation through external communication of accommodating spaces, and increases the loading area, thereby improving the heat dissipation effect and extending the service life of the LED lamp.

Implementation Method 1

an insulation board arranged between two adjacent circuit boards; the insulation board is made of fire-retardant and fire-resistant plastic material

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 2

the connecting columns are in interference fit with the connecting holes, wherein outer diameters of the connecting columns are greater than inner diameters of the connecting holes

Methodology Applied
Scientific EffectInterference fit: Mechanical Fastener

Data Source

PatentUS11988342B1LED circuit board
Publication Date: 2024.05.21 WU QINGBIAO
  • US11988342B1 patent drawing
  • US11988342B1 patent drawing
  • US11988342B1 patent drawing

AI summary

An LED circuit board that includes an insulation board provided with connecting holes and a holding column, and at least two circuit boards; a first circuit board has a through hole, and a second circuit board has connecting columns; the connecting columns are detachably inserted in the connecting holes; the holding column is detachably inserted in the through hole; the insulation board is made of fire-retardant and fire-resistant plastic material.