Patterned Circuit Carrier for High Power LED Thermal Management
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Solution Overview
Problem
The development of cost-effective LED light sources that overcome the limitations of narrow wavelength emission, light intensity, heat dissipation, and packaging costs, while providing a replacement for conventional light sources.
Innovation Solution
A light source design featuring a circuit carrier with patterned conducting layers and an insulating substrate, where the LED die is bonded with contacts to the bottom layer and covered by a reflective encapsulant layer to enhance light directionality and heat dissipation, and optionally includes a phosphor or diffusing material for broader spectrum emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If multiple LEDs are combined to provide equivalent light intensity to conventional light sources, then light intensity is improved, but device complexity increases
Solution Approach 1:
Multiple LED dies are combined on a single substrate to form an integrated light source module, achieving equivalent light intensity to conventional sources while consolidating control and reducing system complexity
Solution Approach 2:
The LED light source is designed to provide multiple color temperatures (e.g., 2000K, 4000K, 6000K) and intensity levels through a single device configuration, replacing the need for multiple separate light sources
2Illumination intensity
If phosphor layers and reflectors are added to improve light extraction efficiency, then light extraction efficiency is improved, but manufacturing cost increases
Solution Approach 1:
Reflective properties are applied selectively to specific surfaces within the LED module rather than the entire structure, optimizing light extraction where needed while reducing material and manufacturing costs
Solution Approach 2:
The encapsulant is formed with a convex curved outer surface that acts as a built-in light redirecting element, eliminating the need for separate reflector components and simplifying manufacturing
3Temperature
If heat conducting paths are added under the LED to manage heat dissipation, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The substrate serves dual functions as both the mounting platform for LED dies and the heat conducting path, eliminating the need for separate thermal management components
Solution Approach 2:
Electrical connection and thermal conduction functions are merged into the same substrate structure, reducing the number of components and simplifying the overall device architecture
4Reliability
If multiple conducting layers and insulating substrates are used to create circuit carriers, then electrical connection is improved, but manufacturing cost increases
Solution Approach 1:
Conducting layers are applied selectively to specific regions of the substrate where electrical connections are needed, rather than covering the entire substrate, reducing material usage and manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves light extraction efficiency, reduces thermal resistance, and lowers production costs by using a flexible printed circuit carrier with high thermal conductivity, allowing for efficient heat management and enhanced light distribution.
Implementation Method 1
a significant fraction of the light generated in the LED remains trapped within the LED... Heat dissipation is also an important factor in the design of LED light sources... the heat generated is localized in a very small area... designs that provide some form of heat-conducting path under the LED are preferred
Implementation Method 2
packages that provide reflectors that redirect the light leaving the side surfaces to the forward direction are often utilized
Implementation Method 3
the narrow emission band limitation of LEDs can be overcome by including a layer of phosphor that converts a portion of the light from the LED to light having a broader spectrum. For example, a blue emitting LED covered by a phosphor that converts blue light to yellow light
Data Source
AI summary
A light source having a circuit carrier and a die is disclosed. The circuit carrier includes top and bottom conducting layers sandwiching an insulating substrate. The bottom layer has a first surface adjacent to the insulating substrate and a second surface includes a portion of a bottom surface of the light source, the substrate having a die bonding region in which the top conducting layer and a portion of the substrate are absent. A portion of the bottom conducting layer is present under the die bonding region and the die is bonded to the top surface of the bottom conducting layer in the die bonding region. The bottom conducting layer is patterned to provide first and second bottom electrodes that are electrically isolated from one another and connected to first and second contacts for powering the LED.