LED Package Structure Using Colloid Dome Lens to Reduce Total Reflection
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Solution Overview
Problem
The existing package structures for light-emitting diode (LED) modules suffer from high total reflection, which reduces the light extraction efficiency from the internal quantum efficiency of LED chips, as most light is reflected back into the module and absorbed by internal electrodes and substrates.
Innovation Solution
A package structure for LED modules that includes a transparent light-pervious member and a colloid member with a thick center and thin periphery, formed using surface tension, to minimize total reflection by allowing light to pass through and concentrate it outwardly, using materials like glass, transparent ceramics, silica gel, or epoxy resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a conventional LED package structure is used, then the internal light-emitting efficiency of the LED chip is high (above 90%), but the external light extraction efficiency is reduced due to total reflection at the package interface
Solution Approach 1:
The patent employs a dome-shaped lens structure made of transparent material covering the LED chip. The curved spherical surface of the dome lens reduces total internal reflection by optimizing the light extraction angle, allowing more light to escape from the LED chip to the external environment, thereby improving external light extraction efficiency while maintaining a relatively simple package structure
Solution Approach 2:
The dome lens acts as an intermediary optical element between the LED chip and the external environment. It mediates the light transmission by providing a transition interface that reduces the abrupt refractive index change, thereby minimizing total reflection and enhancing light extraction without requiring complex package modifications
2Ease of manufacture
If the package structure is simplified, then manufacturing is easier, but light extraction efficiency is reduced due to total reflection
Solution Approach 1:
The dome lens with its curved surface is formed using conventional semiconductor manufacturing techniques such as spin coating and curing, which are already standard in the industry. This approach maintains ease of manufacture while the curved geometry inherently reduces total reflection and light energy loss, achieving both manufacturing simplicity and optical performance
3Illumination intensity
If a transparent structure with thick center and thin periphery is used, then total reflection is reduced and light extraction efficiency is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent utilizes the surface tension of colloid material to automatically form the dome lens structure with thick center and thin periphery during the curing process. The colloid material self-organizes into the desired shape without requiring complex precision control equipment, thereby achieving the optimal thickness distribution for light extraction while keeping manufacturing precision requirements manageable
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly enhances light-emitting efficiency by reducing total reflection within the package, bringing the external light extraction efficiency closer to the internal quantum efficiency of the LED chips, thereby improving the brightness and performance of LED modules.
Implementation Method 1
the colloid member forms a transparent structure with a thick center and a thin periphery using the surface tension of colloid material
Implementation Method 2
the total reflection effect in the package is reduced. Hence, the structure according to the present invention is endowed with nonobviousness and novelty
Data Source
AI summary
The present invention provides a package structure of LED module and the method for manufacturing the same. The method comprises steps of providing a light-emitting module; disposing a light-pervious member on the light-emitting path of the light-emitting module; and dripping a colloid member on the light-pervious member. The light-pervious member is a transparent structure; and the colloid member forms a transparent structure with a thick center and a thin periphery using the surface tension of colloid material. In the above structure, the light-pervious member and colloid member are used for reducing the total reflection effect in the package.