LED Package With Concave Substrate for Thermal Adhesive Placement
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Solution Overview
Problem
Conventional lighting technologies, such as incandescent and fluorescent bulbs, suffer from high power consumption, short lifespan, fragility, and environmental concerns due to mercury content, while LED lamps address these issues but require effective heat dissipation solutions.
Innovation Solution
An LED package structure with a substrate having concave spaces for positioning heat-conducting adhesive layers and LED chips, where the adhesive layers efficiently dissipate heat generated by the chips, and a translucent resin body covers the components for protection and light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If conventional lighting technologies (incandescent and fluorescent bulbs) are used, then lighting function is provided, but power consumption is high and lifespan is short
Solution Approach 1:
The patent transitions from conventional lighting technologies to LED technology, fundamentally changing the operating parameters and mechanism of light generation. LEDs consume significantly less power and provide longer lifespan by using electroluminescence in semiconductor materials instead of thermal radiation or gas discharge
Solution Approach 2:
The invention replaces the mechanical/electrical systems of incandescent bulbs (filament heating) and fluorescent bulbs (gas discharge with phosphor excitation) with a semiconductor-based LED system that converts electrical energy directly to light through electroluminescence, eliminating the need for filaments, gases, and complex ballasts
2Use of energy by moving object
If LED lamps are used to reduce power consumption and increase lifespan, then energy efficiency is improved, but heat dissipation becomes a critical challenge
Solution Approach 1:
The patent introduces a heat-conducting adhesive layer as an intermediary substance between the LED chip and the substrate. This adhesive layer with high thermal conductivity serves as a thermal bridge to efficiently transfer heat away from the LED chip, solving the heat dissipation challenge while maintaining the energy efficiency benefits of LED technology
Solution Approach 2:
The invention applies heat-conducting adhesive specifically at the critical heat-generating interface between the LED chip and substrate, concentrating thermal management resources where they are most needed. The concave space design further localizes the heat-conducting material directly beneath the LED chip for optimal thermal coupling
3Temperature
If heat-conducting adhesive is applied to improve heat dissipation, then thermal management is enhanced, but positioning precision of LED chips may be compromised
Solution Approach 1:
The patent forms concave spaces on the substrate surface before mounting the LED chips. These pre-formed recesses are designed to precisely accommodate the LED chips and contain the heat-conducting adhesive, ensuring both accurate positioning and effective thermal coupling. The preliminary structuring of the substrate geometry guides precise component placement
Solution Approach 2:
The heat-conducting adhesive layer acts as a flexible thermal interface material that can conform to the precise geometry of the concave space and LED chip surfaces. This thin film approach maintains positioning precision while providing excellent thermal contact, adapting to surface variations without requiring rigid mechanical constraints
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides efficient heat dissipation and enhanced durability of LED packages, reducing environmental impact and improving lighting performance by using concave spaces on the substrate to position heat-conducting adhesive layers and LED chips, thus addressing the limitations of traditional lighting technologies.
Implementation Method 1
uses at least one heat-conducting adhesive layer to efficiently dissipate heat generated by the LED chips
Data Source
AI summary
An LED package structure with concave area for positioning heat-conducting substance includes a substrate unit, a heat-conducting adhesive unit, a light-emitting unit, a conductive unit and a package unit. The substrate unit has a substrate body, a concave space formed on the substrate body, and a plurality of positive and negative pads exposed on the substrate body. The heat-conducting adhesive unit has a heat-conducting adhesive layer positioned in the concave space. The light-emitting unit has a plurality of LED chips disposed on the heat-conducting adhesive layer and received in the concave space. The conductive unit has a plurality of wires. Each LED chip is electrically connected between each positive pad and each negative pad. The package unit has a translucent package resin body disposed on the substrate body in order to cover the LED chips and the wires.