LED Light Extraction via Concavo-Convex Substrate and Thermal Support
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Solution Overview
Problem
Current light emitting devices using III-V nitride semiconductors face challenges in achieving optimal light extraction efficiency and heat dissipation, leading to reduced performance and reliability.
Innovation Solution
The design incorporates a light emitting device structure with a substrate having a concavo-convex pattern, a support member with thermal diffusers, and a reflective electrode layer, along with a flip bonding scheme to enhance light extraction and heat dissipation, utilizing a DBR structure and ceramic materials for improved thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional LED structure with planar substrate and simple electrode configuration is used, then the device complexity is low and ease of manufacture is high, but light extraction efficiency is insufficient and heat dissipation performance is poor
Solution Approach 1:
The substrate surface is divided into concave and convex regions, creating a non-planar structure that segments the light extraction paths. This segmentation increases the effective light extraction area and reduces total internal reflection, thereby improving light extraction efficiency without requiring complex external optical components
Solution Approach 2:
The invention transitions from a two-dimensional planar substrate to a three-dimensional concavo-convex structure. This dimensional change creates additional light extraction interfaces and pathways, enabling improved light extraction efficiency while maintaining structural integrity and manufacturability
2Reliability
If conventional thermal management structures are used, then the device complexity is low, but heat dissipation performance is insufficient leading to reduced reliability
Solution Approach 1:
The support member integrates multiple functions: mechanical support, thermal conduction, and electrical isolation. By merging these functions into a single component with thermal diffusers, the structure achieves improved heat dissipation while avoiding the complexity of separate thermal management systems
Solution Approach 2:
The support member is constructed as a composite structure combining resin material with thermally conductive particles. This composite approach enhances thermal conductivity for improved heat dissipation while maintaining the electrical isolation properties of the resin matrix, achieving dual functionality without excessive complexity
3Temperature
If resin-based support members without thermal enhancement are used, then ease of manufacture is high and device complexity is low, but thermal conductivity is insufficient leading to poor heat dissipation
Solution Approach 1:
The support member combines resin base material with thermally conductive particles to create a composite structure. This approach significantly enhances thermal conductivity while maintaining the ease of manufacturing associated with resin-based materials, as the particles can be mixed into the resin during the molding process
Solution Approach 2:
The invention modifies the thermal conductivity parameter of the support member by incorporating thermally conductive particles. This parameter change improves heat dissipation performance while the manufacturing process remains relatively simple, as it involves mixing particles into the resin and curing, which are standard procedures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves light extraction efficiency and heat dissipation, resulting in enhanced performance and reliability of the light emitting device.
Implementation Method 1
a support member with thermal diffusers
Implementation Method 2
a reflective electrode layer
Implementation Method 3
utilizing a DBR structure
Implementation Method 4
ceramic materials for improved thermal conductivity
Data Source
Figure 1~2
Figure 3~5
Figure 6~8
AI summary
A light emitting device (100) may be provided that includes a substrate (111), a light emitting structure (120), a first electrode (135) under a first semiconductor layer (115), a reflective electrode layer (131) under a second conductive semiconductor layer (119), a second electrode (137) under the reflective electrode layer (131), and a support member (151) under the first semiconductor layer (115) and the reflective electrode layer (131) around the first and second electrodes (135,137). A first connection electrode (141) may be provided under the first electrode (135). At least a part of the first connection electrode (141) is provided in the support member (151). A second connection electrode (143) may be provided under the second electrode (137). At least a part of the second connection electrode (143) may be provided in the support member (151).