LED Conductive Support for ESD Protection

Solution Overview

Problem

Conventional light source modules using Zener diodes for electrostatic discharge (ESD) protection are restricted by component specifications, increasing manufacturing costs and complexity, and are prone to damage from ESD.

Innovation Solution

A light source module design where a conductive support protrudes from the insulation housing of a light-emitting diode to conduct exterior static electricity, eliminating the need for a Zener diode and simplifying production while providing effective ESD protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a Zener diode is used for ESD protection, then the LED can be protected from electrostatic discharge, but the device complexity and manufacturing cost increase

Engineering Contradiction:

ImproveESD protection capabilityVSAvoidcomponent configuration

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the heat-dissipating support and conductive support into a single integrated component. The conductive support is formed by extending the heat-dissipating support to protrude out the insulation housing, merging two functions (heat dissipation and ESD conduction) into one structure, thereby eliminating the need for separate Zener diodes and reducing device complexity

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The conductive support serves multiple functions: it acts as both a heat-dissipating support and an ESD protection element. By making the conductive support extend from the heat-dissipating support, it provides both thermal management and electrostatic discharge protection capabilities within a single component

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If a Zener diode is used for ESD protection, then the LED can be protected from electrostatic discharge, but the manufacturing cost increases

Engineering Contradiction:

ImproveESD protection capabilityVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines the heat-dissipating support and conductive support into a single integrated component. The conductive support is formed by extending the heat-dissipating support to protrude out the insulation housing, merging two functions (heat dissipation and ESD conduction) into one structure, thereby eliminating the need for separate Zener diodes and reducing device complexity

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent uses a simple conductive support structure that can be manufactured at low cost using existing processes. By eliminating the need for expensive Zener diodes and their associated mounting components, the overall manufacturing cost is reduced while maintaining ESD protection functionality

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

3Reliability

If a Zener diode is used for ESD protection, then the LED can be protected from electrostatic discharge, but the configuration space is consumed

Engineering Contradiction:

ImproveESD protection capabilityVSAvoidconfiguration space

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent combines the heat-dissipating support and conductive support into a single integrated component. The conductive support is formed by extending the heat-dissipating support to protrude out the insulation housing, merging two functions (heat dissipation and ESD conduction) into one structure, thereby eliminating the need for separate Zener diodes and reducing device complexity

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively conducts exterior static electricity away from the light-emitting diode chip, reducing the risk of damage, lowering production costs, and enhancing ESD protection without the limitations of Zener diode configurations.

Implementation Method 1

The conductive support is disposed on an exterior side surface of the insulation housing and is connected to the heat-dissipating support to protrude out the light-out surface. Thereby, the exterior static electricity discharged to the light-emitting diode is conducted out through the conductive support

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS8432089B2Light source module and backlight module

Publication Date: 2013.04.30 SAMSUNG DISPLAY CO LTD

AI summary

A light source module and a backlight module therewith are disclosed. The light source includes a circuit board and a light-emitting diode disposed on the circuit board. The light-emitting diode includes a package unit and a conductive support. The package unit includes an insulation housing, a heat-dissipating support embedded in the insulation housing, and a light-emitting diode chip disposed on the heat-dissipating support and encapsulated by the insulation housing. The light-emitting diode chip includes two electrodes, which are isolated form the heat-dissipating support. The insulation housing thereon defines a light-out surface. The conductive support is disposed on an exterior side surface of the insulation housing and connected to the heat-dissipating support to protrude out the light-out surface. Thereby, the protruding conductive support is also isolated from the two electrodes so as to perform ESD protection for avoiding unexpected damage to the light-emitting diode and extending service life thereof.