LED Electrode Connection Coating for Corrosion-Resistant Reliability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for manufacturing light-emitting devices face challenges in achieving high reliability due to issues with electrical connectivity and protection from corrosive substances, particularly when exposed to high temperatures.
Innovation Solution
A method involving the preparation of a substrate with wiring parts, the disposition of a light-emitting element with electrodes, and the use of copper-containing electrically-conductive members with body and protruding portions. These members are connected to the wiring parts and electrodes, and a protective film is applied using the atomic layer deposition method to cover gaps between the protruding portions and the substrate, ensuring a reliable electrical connection and protection from corrosion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper-containing electrically-conductive members are used to connect wiring parts to electrodes, then electrical conductivity is improved, but susceptibility to corrosion from corrosive substances worsens
Solution Approach 1:
The patent introduces a protective film as an intermediary layer between the copper-containing electrically-conductive member and the external environment. This protective film acts as a mediator that prevents direct contact between corrosive substances and the copper, thereby maintaining electrical conductivity while providing corrosion resistance. The protective film is specifically designed to cover the electrically-conductive member without interfering with its electrical function.
Solution Approach 2:
The patent creates a composite structure by combining copper-containing electrically-conductive material with protective coating materials. This composite approach allows the system to simultaneously exhibit high electrical conductivity (from the copper) and corrosion resistance (from the protective film). The multi-material construction addresses both the electrical connectivity requirement and the corrosion protection need.
2Object-affected harmful factors
If protective film is applied to cover gaps between electrically-conductive members and substrate, then corrosion protection is improved, but manufacturing complexity worsens
Solution Approach 1:
The patent employs atomic layer deposition (ALD) technology, which is a self-limiting deposition process that automatically forms uniform thin films conformally covering complex three-dimensional structures. The ALD process inherently adapts to the geometry of the substrate and electrically-conductive members, depositing protective material on all surfaces including gaps and recesses without requiring additional manual intervention or complex tooling. This self-adjusting nature of ALD simplifies the manufacturing process despite the complex geometry.
Solution Approach 2:
The patent replaces traditional mechanical or manual protective coating methods with atomic layer deposition, a vapor-phase deposition technique. This substitution eliminates the need for complex mechanical masking, alignment, and application procedures. The ALD process uses chemical vapor deposition to automatically form the protective film, replacing cumbersome mechanical operations with a more streamlined chemical process that achieves better coverage and uniformity.
3Manufacturing precision
If heating is applied to widen gaps for protective film deposition, then film coverage is improved, but risk of damage to light-emitting element worsens
Solution Approach 1:
The patent carefully controls the heating parameters during atomic layer deposition to achieve optimal gap widening. By precisely adjusting the temperature, heating duration, and deposition conditions, the process achieves sufficient gap expansion for complete protective film coverage while staying below the damage threshold of the light-emitting element. This parameter optimization allows the system to achieve good film coverage without compromising element integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed method enhances the reliability of light-emitting devices by ensuring robust electrical connectivity and effective protection against corrosive substances, even under high-temperature conditions, thereby reducing the risk of electrical short circuits and corrosion.
Implementation Method 1
disposing a protective film at least in the gap by using an atomic layer deposition method
Implementation Method 2
in a state in which the gap is widened by heating the electrically-conductive member at a temperature of 150° C. or more and 250° C. or less
Data Source
AI summary
A method of manufacturing a light-emitting device includes: providing a substrate including a base, and a pair of wiring parts disposed on an upper surface side of the base; providing a light-emitting element including a semiconductor structure, and a pair of electrodes; disposing the light-emitting element above the substrate such that the electrodes face the wiring parts; disposing an electrically-conductive member containing copper such that the electrically-conductive member electrically connects the wiring parts to the electrodes and includes a body portion and a protruding portion, the body portion overlapping a corresponding wiring part of the wiring parts in a top view, and the protruding portion protruding outward such that a gap is located between the protruding portion and the base; and disposing a protective film at least in the gap in a state in which the gap is widened by heating the electrically-conductive member.