LED Cooling Device Using Heat Pipes for Noiseless Thermal Management
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Solution Overview
Problem
Existing cooling solutions for LED modules are either inefficient, noisy, or unsuitable for indoor use due to their size, weight, and inability to effectively manage heat dissipation, particularly for high-density LED setups.
Innovation Solution
A cooling device featuring heat-conducting tubes embedded in a base body with a U-shaped design that encompasses the LED module, utilizing heat pipes and fins for efficient heat transfer and dissipation, along with slats and support plates for optimal thermal contact and noise reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If passive cooling with heat sinks is used, then cooling capacity is provided, but space requirement and weight increase significantly
Solution Approach 1:
The patent employs heat pipes that utilize phase transition of working fluid (evaporation at hot end, condensation at cold end) to transfer heat efficiently from the LED module to the heat sink, achieving superior heat dissipation with reduced material mass compared to conventional passive heat sinks
Solution Approach 2:
The heat pipe system uses fluid dynamics (capillary action and pressure gradients) to circulate working fluid through the heat pipe structure, enabling active heat transport without external power, thus reducing the need for heavy passive cooling structures
2Temperature
If active cooling with motor-driven fans is used, then cooling efficiency improves, but noise and energy consumption increase
Solution Approach 1:
The heat pipe system is self-regulating and requires no external power source or control mechanisms. The phase change process automatically responds to temperature differences, providing adaptive cooling without motors, fans, or electronic controls that generate noise
Solution Approach 2:
The patent replaces mechanical cooling systems (motors, fans, oscillating membranes) with a thermodynamic system based on phase transitions and heat conduction, eliminating mechanical moving parts that generate noise and require electrical power
3Temperature
If conventional heat pipe arrangements are used, then heat dissipation is achieved, but the design is not suitable for indoor lighting applications
Solution Approach 1:
The patent integrates the heat pipe cooling system directly with the LED module housing and optical components, combining thermal management functions with the lighting structure itself. This integrated design achieves compact proportions suitable for indoor lighting fixtures while maintaining effective heat dissipation
Solution Approach 2:
The heat pipes are strategically positioned to contact the hottest zones of the LED module (where LEDs are mounted on the heat sink), providing targeted cooling where heat generation is most intense, while the overall device dimensions are optimized for indoor lighting applications
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides effective, noiseless, and space-saving cooling for high-density LED modules, ensuring prolonged lifespan and maintaining specified luminous output and service life by efficiently managing heat dissipation.
Implementation Method 1
utilizing heat pipes and fins for efficient heat transfer and dissipation
Implementation Method 2
Heat pipes run parallel to each other and to the metal contact surfaces, parallel to the heat source with the hottest zone (hot spot)
Implementation Method 3
on the other (second) End portion of a heat sink consisting of several fins is attached
Implementation Method 4
The heat sink, which essentially consists of many parallel, spaced fins, extends over the entire second end portion of the heat-conducting tubes
Implementation Method 5
The heat pipes run with one end in the immediate vicinity along the hot base of the LED module over its entire length, so that very good heat conduction from the heat source to the heat pipe is ensured
Data Source
Figure 1~2
Figure 3~5
Figure 6~8
AI summary
The invention relates to a cooling device for a heat source, especially LED modules fitted with many components, said device comprising a base body (2) that is in thermal and mechanical contact with the body of the heat source (12), at least one thermoconducting tube (4, 5, 6) having an end section that is inserted into the base body (2) in a form-fitting and thermoconducting manner, and at least one cooling body (3) comprising cooling body lamellae (20) on the other end section of the thermoconducting tube. The invention is characterised in that the thermoconducting tubes (4, 5, 6) extend over the entire length of the base body (2) such that a hot zone (16, 34) of the heat source (12) lies on a contact surface (21) of the base body (2), the thermoconducting tubes extend parallel to each other and parallel to the contact surface of the heat source with the hottest zone (16, 34), and the base body (2) is fixed to the body of the heat source (12), base body lamellae (10) being provided on the outer side of the base body (2), formed as a single component thereon or connected thereto.