LED Light Source Cooling Structure for Homogeneous UV Curing
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Solution Overview
Problem
Existing light-emitting diode (LED) modules for curing UV-curable inks and varnishes in the printing industry face inefficiencies in cooling, leading to reduced efficiency, shortened lifespan, and mechanical instability, often requiring complex and costly cooling circuits.
Innovation Solution
A light source design featuring a first carrier element with a cooling surface and a distributor element connected by a fluid path, incorporating a cooling structure with ribs and ducts for homogeneous cooling, allowing for flexible adaptation and low-complexity assembly, using conventional tools like CNC milling, and enabling rapid, stable curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a simple passage cooling structure is used in the support, then the device complexity is reduced, but the cooling efficiency deteriorates, requiring a powerful and energy-intensive cooling circuit to compensate
Solution Approach 1:
The support is segmented into multiple copper layers with interconnected micro ducts and macro ducts, creating a distributed cooling network that efficiently removes heat from LED packs without requiring a powerful external cooling circuit
Solution Approach 2:
A liquid cooling circuit is implemented through the multi-layer copper support structure, using fluid flow through micro and macro ducts to transport heat away from LED packs, replacing the need for high-power cooling systems
2Temperature
If a multiplicity of copper layers with fine cooling structure is used, then the cooling efficiency is improved, but the manufacturing complexity and cost increase significantly
Solution Approach 1:
The cooling structure is divided into multiple copper layers with systematic micro and macro duct patterns, allowing efficient heat removal while maintaining manufacturability through standardized layer construction
Solution Approach 2:
The copper layers serve multiple functions: electrical connectivity, mechanical support, and thermal management through integrated micro and macro ducts, reducing the need for separate cooling components
3Temperature
If the wall thickness of the support is reduced to accommodate fine cooling structure, then the cooling performance is improved, but the mechanical strength deteriorates, making the support vulnerable to damage from pressure peaks and assembly stress
Solution Approach 1:
The support is constructed as a multi-layer copper structure with distributed micro and macro ducts, where the layered architecture provides both efficient cooling pathways and enhanced mechanical strength to withstand pressure peaks and assembly stresses
Solution Approach 2:
The support uses copper layers with integrated cooling channels, combining high thermal conductivity of copper with structurally robust wall thickness, creating a composite structure that simultaneously achieves superior cooling performance and mechanical strength
4Manufacturing precision
If complex production methods are used to create tightly connected copper layers, then the manufacturing precision is improved, but the device complexity and production cost increase
Solution Approach 1:
The support is manufactured as standardized multi-layer copper components with precise micro and macro duct patterns, allowing accurate assembly through modular construction while simplifying the overall production process
Solution Approach 2:
The copper layers are manufactured with controlled wall thickness and duct dimensions, optimizing the balance between cooling efficiency and mechanical strength while maintaining manufacturability through standardized parameters
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves homogeneous, rapid curing with low complexity and mechanical stability, reducing the risk of damage and production costs, while allowing for easy maintenance and recyclability of components.
Implementation Method 1
a first fluid path that is at least in part delimited by the first cooling surface
Implementation Method 2
provides a flow of cooling liquid for cooling the LEDs
Data Source
AI summary
A light source. The light source includes as components which superimpose one another in this sequence: a first light-emitting semiconductor component; a first carrier element comprising a first carrier surface which faces the first light-emitting semiconductor component and a first cooling surface deliminating at least in part a first fluid path; and a distributor element comprising a first cavity and a further cavity. The first cavity and the further cavity are fluidically connected to one another by the first fluid path. Also disclosed are a printing machine; methods, in particular for producing a printed product, for irradiating a material to be irradiated, and for producing a light source; corresponding method products; an assembly having the light source; and uses of the light source.